Arteris Articles

Semiconductor Engineering: In-System Networks Are Front And Center

 Arteris IP's Kurt Shuler, VP of Marketing, authored this article and offers his perspective on HotChips 2019 in this latest Semiconductor Engineering:

In-System Networks Are Front And Center

September 15th, 2019 - By Kurt Shuler

AI demands push innovation in design architectures and techniques.

 

This year’s HotChips conference at Stanford was all about artificial intelligence (AI) and machine learning (ML) and what particularly struck me, naturally because we’re in this business too, was how big a role on-chip networks played in some of the leading talks.

Giant leaps are being made in supporting new AI architectures, tuning them for optimum performance per milliwatt and embedding them effectively into traditional and novel SoC architectures.

You can learn more by reading my white paper titled, "Re-Architecting SoCs for the AI Era". Download is free; https://www.arteris.com/download-re-architecting-socs-for-the-ai-era

Topics: SoC functional safety ISO 26262 machine learning cache coherency semiconductor engineering AI kurt shuler noc interconnect SOTIF (ISO 21448 Hot Chips bigger chips

Semiconductor Engineering: Chiplets, Faster Interconnects, More Efficiency

 Arteris IP's K. Charles Janac, president and CEO, chats with Ed Sperling at Hot Chips in this latest Semiconductor Engineering article:

Chiplets, Faster Interconnects, More Efficiency

August 22nd, 2019 - By Ed Sperling

Big chipmakers are turning to architectural improvements such as chipsets, faster throughput both on-chip and off-chip, and concentrating more work per operation or cycle, in order to ramp up processing speeds and efficiency.

 

“Everyone is struggling with CCIX,” said K. Charles Janac, president and CEO of Arteris IP. “If you have an accelerator and two coherent dies, there are too many corner cases to get it to work easily. But now you can use 3D interconnects to hook together a planar CPU and a planar I/O. So this looks like one system to the software, and you have inter-chip links between the network on chip and different die. That way you can support non-coherent and coherent read/write across two die. It makes the interconnect more valuable, but it also makes it more complicated.”

“The memory controller and the NoC will have to be much more tightly integrated,” said Janac. “The problem is that neither one understands the QoS of the entire chip, and there aren’t any independent memory controller companies left. But memory traffic has to be better integrated to make this work.”

For more information, please visit our Resources page for free downloads of our technical papers; http://www.arteris.com/resources

Topics: SoC ArterisIP FlexNoC ncore cache coherent interconnect semiconductor engineering K. Charles Janac noc interconnect Hot Chips