Arteris Articles

Arteris IP Awarded "Best Ecosystem Partner of 2019" by AI Pioneer Canaan

Last month, Canaan Inc. successfully went public with an IPO on Nasdaq. And just last week, our Arteris IP team was invited to attend a grand dinner to celebrate this wonderful achievement. During the dinner, Arteris IP was awarded by Canaan the "Best Ecosystem Partner of 2019 Award" which Rick Sun, our China Sales Manager (second from the right in the above photo) is holding. 

The entire Arteris IP team is proud that our efforts have helped contribute to Canaan's success on their AI chip, and we we look forward to more activities with them as they continue their explosive growth. This award is a testament not only to our products and technologies, but also the excellent Arteris IP team members supporting our customers worldwide.

Topics: semiconductor machine learning artificial intelligence AI SoCs flexnoc ai package noc interconnect ML

Semiconductor Engineering: In-System Networks Are Front And Center

 Arteris IP's Kurt Shuler, VP of Marketing, authored this article and offers his perspective on HotChips 2019 in this latest Semiconductor Engineering:

In-System Networks Are Front And Center

September 15th, 2019 - By Kurt Shuler

AI demands push innovation in design architectures and techniques.

 

This year’s HotChips conference at Stanford was all about artificial intelligence (AI) and machine learning (ML) and what particularly struck me, naturally because we’re in this business too, was how big a role on-chip networks played in some of the leading talks.

Giant leaps are being made in supporting new AI architectures, tuning them for optimum performance per milliwatt and embedding them effectively into traditional and novel SoC architectures.

You can learn more by reading my white paper titled, "Re-Architecting SoCs for the AI Era". Download is free; https://www.arteris.com/download-re-architecting-socs-for-the-ai-era

Topics: SoC functional safety ISO 26262 machine learning cache coherency semiconductor engineering AI kurt shuler noc interconnect SOTIF (ISO 21448 Hot Chips bigger chips

SemiWiki: AI, Safety and the Network

Kurt Shuler, VP Marketing at Arteris IP, and Bernard Murphy (SemiWiki) discuss, 'What is driving the boom in AI-centric design', in this new SemiWiki blog:

AI, Safety and the Network

September 4th, 2019 - By Bernard Murphy

You probably know that Arteris IP is very active in AI and safety, leveraging their central value in network-on-chip (NoC) architectures. Bernard Murphy of SemiWiki blogged on Kurt Shuler's front-to-back white-paper to walking us through the essentials of AI, particularly machine learning (ML) and its application for example in cars.

Kurt also highlights an interesting point about this rapidly evolving technology. As we build automation from the edge to the fog to the cloud, functionality, including AI, remains quite fluid between levels. Kurt points out that this is somewhat mirrored in SoC design. In both cases architecture is constrained by need to optimize performance and minimize power across the system through intelligent bandwidth allocation and data locality. And for safety-critical applications, design and verification for safety around intelligent features must be checked not only within and between SoCs in the car but also beyond, for example in V2x communication between cars and other traffic infrastructure.

You can learn more by downloading this Arteris IP white paper titled, Re-Architecting SoCs for the AI Era: https://semiwiki.com/automotive/274598-ai-safety-and-the-network/

Topics: SoC functional safety ISO 26262 semiconductor automotive ADAS machine learning artificial intelligence semiwiki kurt shuler flexnoc ai package noc interconnect

New! Arteris IP Technical Paper, Re-Architecting SoCs for the AI Era

Kurt Shuler, VP of Marketing at Arteris IP has written this 10-page technical paper titled, "Re-Architecting SoCs for the AI Era".

August 29, 2019 - by Kurt Shuler

Abstract:
The growth of artificial intelligence (AI) demands that semiconductor companies re-architect their system on chip (SoC) designs to provide more scalable levels of performance, flexibility, efficiency, and integration. From the edge to data centers, AI applications require a rethink of memory structures, the numbers and types of heterogeneous processors and hardware accelerators, and careful consideration of how the dataflow is enabled and managed between the various high-performance IP blocks.

Topics: functional safety ISO 26262 semiconductor machine learning autonomous driving artificial intelligence AI SoCs kurt shuler noc interconnect ML dataflow