Arteris Articles

Semiconductor Engineering: AI Chips: NoC Interconnect IP Solves Three Design Challenges

 Arteris IP's Kurt Shuler warns that regular topologies, large chips, and huge bandwidths are considerations in AI-centric chips in the date center.

AI Chips: NoC Interconnect IP Solves Three Design Challenges  

January 10th,  2019 - By Kurt Shuler

New network-on-chip (NoC) interconnect IP is now available for artificial intelligence (AI) systems-on-chip (SoC). Arteris IP launched the fourth generation of FlexNoC interconnect IP with a new AI package.

The new NoC technology benefits emerging AI chip architectures in three main ways: automatically generating regular topologies, effectively managing the data flows of large chips with long wires and enabling large on- and off-chip bandwidths.

To learn more, please visit the FlexNoC AI Package page; https://www.arteris.com/flexnoc-ai-package and the Resources page: https://www.arteris.com/resources

Topics: AI chips semiconductor AI automotive neural networks ML AI SoC Designers flexnoc ai package VC-Links synchronous virtual channels noc interconnect

SemiWiki: Disturbances in the AI Force

Bernard Murphy (SemiWiki) reflects on a discussion with Kurt Shuler, VP Marketing at Arteris IP, on customer trends in design for advanced ML accelerators, why these look quite different from traditional processor architectures and the implication for design particularly around the NoC interconnect in this SemiWiki blog:

Disturbances in the AI Force

January 3rd, 2019 - By Bernard Murphy

In the normal evolution of specialized hardware IP functions, initial implementations start in academic research or R&D in big semiconductor companies, motivating new ventures specializing in functions of that type, who then either build critical mass to make it as a chip or IP supplier (such as Mobileye - initially) or get sucked into a larger chip or IP supplier (such as Intel or ARM or Synopsys). That was where hardware function ultimately settled, and many still do.

But recently the gravitational pull of mega-companies has distorted this normally straightforward evolution. In cloud services this list includes Amazon, Microsoft, Baidu and others. In smartphones you have Samsung, Huawei and Apple - yep, Huawei is ahead of Apple in smartphone shipments and is gunning to be #1. These companies, neither semiconductor nor IP, are big enough to do whatever they want to grab market share. What they do to further their goals in competition with the other giants can have a major impact on the evolution path for IP suppliers.

Arteris IP is closely involved with many of these companies, from Cambricon to Huawei/HiSilicon to Baidu to emerging companies like Lynxi, offering their network on chip (NoC) solutions with the AI package allowing for architecture tuning to the special needs of high-end NN designs. Check out more here; http://www.arteris.com/flexnoc-ai-package

Topics: semiwiki kurt shuler NoC semiconductor AI chips flexnoc ai package hardware ip accelerators noc interconnect