Arteris Articles

Semiconductor Engineering: AI Chips: NoC Interconnect IP Solves Three Design Challenges

 Arteris IP's Kurt Shuler warns that regular topologies, large chips, and huge bandwidths are considerations in AI-centric chips in the date center.

AI Chips: NoC Interconnect IP Solves Three Design Challenges  

January 10th,  2019 - By Kurt Shuler

New network-on-chip (NoC) interconnect IP is now available for artificial intelligence (AI) systems-on-chip (SoC). Arteris IP launched the fourth generation of FlexNoC interconnect IP with a new AI package.

The new NoC technology benefits emerging AI chip architectures in three main ways: automatically generating regular topologies, effectively managing the data flows of large chips with long wires and enabling large on- and off-chip bandwidths.

To learn more, please visit the FlexNoC AI Package page; https://www.arteris.com/flexnoc-ai-package and the Resources page: https://www.arteris.com/resources

Topics: AI chips semiconductor AI automotive neural networks ML AI SoC Designers flexnoc ai package VC-Links synchronous virtual channels noc interconnect

ElectronicDesign Article: Speed Machine-Learning Accelerators with Flexible Interconnect


This ElectronicsDesign article, 'Speed Machine-Learning Accelerators with Flexible Chip Interconnect', covers the announcement of Arteris IP's new FlexNoc with AI Package in this interview with Kurt Shuler, VP Marketing at Arteris IP. 

November 1 , 2018 - By William Wong

Topics: OEMs SoCs noc multicast AI FlexNoC AI chips broadcast torus noc autonomous vehicles VC-Links