C2C™ Chip to Chip Link™ Inter-chip Connectivity IP

The purpose of inter-chip connectivity IP is to connect two different chips together to share computing resources, limit chip-to-chip latency, or maintain the highest possible chip-to-chip bandwidth. Inter-chip connectivity is also often described as chip-to-chip, die-to-die or C2C links.

Arteris® offers the C2C Chip to Chip Link product and is also a contributor to the MIPI Low Latency Interface (MIPI LLI) specification.

Learn more about interchip connectivity IP by reading, "Interchip Connectivity: HSIC, UniPro, HSI, C2C, LLI...oh my!"

Chip to Chip Link (C2C)

Chip to Chip Link (also known as C2C) offers the capability to connect two chips without a PHY, using only DDR pads.  “C2C” is a trademark of Texas Instruments, Inc., and is a product containing TI and Arteris technology.

C2C for Mobile Phones

C2C’s primary purpose is to connect a mobile phone applications processor to a mobile phone modem. The 100ns round-trip latency of the C2C connection is fast enough for the modem to share the application processor’s RAM and to maintain enough read throughput for cache refills.

This enables the phone manufacturer to remove the modem’s dedicated RAM chip from the phone’s bill of materials (BOM).

C2C Benefits

Using C2C saves a mobile phone vendor at least $2 from RAM cost savings alone. This savings is even larger when one includes the benefits of reduced board area / cost.

C2C can also be used in non-mobile applications where low latency and high bandwidth between chips is required, such as co-processing applications.

C2C Specifications

Trademark notice: “C2C”, “Chip to Chip Link”, “C2C Link” and “C2C Interface” are trademarks of Texas Instruments, Inc.