November 16, 2010
SUNNYVALE, California — November 2, 2010 — Arteris, Inc., a leading supplier of on-chip interconnect IP solutions, today announced that Samsung Electronics Co., Ltd., has selected Arteris’ interconnect solutions for multiple chips within Samsung’s mobile SOC products. Samsung chose Arteris interconnect IP to support the high speed inter-chip communication requirements in next generation mobile SOC products.
The Arteris interconnect IP offers us a convenient solution to handle the high speed communication needed between our SoC and external modem IC. Our customers will benefit from the lower BOM cost and power consumption as a result of this IP. We look forward to Arteris’ interconnect IP helping us shorten development schedules and lower risks associated with compatibility.
Thomas Kim, Vice President, SoC Platform Development, System LSI, Samsung Electronics