Arteris Press Releases

VIA Telecom Selects Arteris C2C High-Speed Inter-Chip
Communications IP

C2C™ Chip-to-Chip Link IP Enables Mobile Phone Baseband Memory Sharing and Lower Bill of Materials (BOM)

SUNNYVALE, California – October 25, 2011 – Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that VIA Telecom has licensed the C2C™ Chip-to-Chip Link interconnect IP solution for high speed inter-chip communication between mobile phone modem baseband chips and application processors.

The C2C interconnect IP offers us a simple solution to connect to industry-leading application processors while removing the requirement for a dedicated DRAM memory connected to our modem baseband. Customers choosing VIA’s modems will be able to experience lower overall BOM cost and easier integration.

VIA Telecom Arteris NoC
Mark Davis, Chief Technology Officer, VIA Telecom