Arteris Press Releases

HiSilicon Using Arteris FlexNoC Interconnect Fabric IP in Multiple Product Lines

Network-on-Chip technology shortens design times and increases productivity

SUNNYVALE, California — May 30, 2013 — Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that HiSilicon Microelectronics, Inc. (Nasdaq:HiSilicon) has selected Arteris® FlexNoC® interconnect IP as the backbone SoC interconnect for its new wireless systems-on-chip (SoC) platforms.

HiSilicon’s use of Arteris FlexNoC fabric IP throughout their SoC product lines will continue to help reduce time-to-market and product costs.


Charlie Janac, President and CEO, Arteris

Topics: new customer Huawei / HiSilicon wireless mobility china

RDA Leverages Arteris FlexNoC Interconnect IP for Next Generation SoCs

Interconnect fabric IP also improves time-to-market for new Smartphone processors

SUNNYVALE, California — May 28, 2013 — Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that RDA Microelectronics, Inc. (Nasdaq:RDA) has selected Arteris® FlexNoC® interconnect IP as the backbone SoC interconnect for its new wireless systems-on-chip (SoC) platforms.

The Arteris FlexNoC commercial SoC interconnect fabric IP meets the performance metrics established by our mobile phone customers. These results gave us the confidence to implement the solution in our critical Smartphone SoC platform. We have very high expectations and feel confident that Arteris will meet our needs.


Vincent Tai, Chairman and CEO, RDA

Topics: new customer wireless mobility RDA china