New technology augments network-on-chip interconnect IP, boosting reliability while improving design flexibility for automotive, aerospace and industrial electronics
CAMPBELL, California — September 30, 2014 — Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced the new FlexNoC Resilience Package designed to increase reliability and lower the cost of developing resilient and fault tolerant systems-on-chip (SoCs). The FlexNoC Resilience Package enhances the benefits of Arteris FlexNoC network-on-chip fabric IP to automotive, aerospace defense, industrial equipment and other electronics markets requiring fault tolerance.
A growing number (of OEMs and system suppliers) are turning to safety- and security-optimized network-on-chip subsystems for SoCs, such as the FlexNoC Resilience Package, to lower the development costs and the time it takes to achieve the ISO 26262 certification, enabling both media-intense processing and certifiable mission critical solutions in an integrated SoC.
Tom Hackenberg, Automotive Embedded Processors Principal Analyst, IHS Technology