Arteris Press Releases

ArterisIP Expands Worldwide Engineering Centers of Excellence and Talent Roster

Silicon Valley, Austin and Paris, France facilities build-out accommodates growth in engineering capabilities

CAMPBELL, Calif. — October 31, 2017 — ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced the expansion of its worldwide office infrastructure to accommodate its accelerated growth in engineering talent and design momentum in the artificial intelligence and automotive markets.

ArterisIP’s investments in our engineering team and facilities are a testament to our commitment to SoC interconnect IP technology leadership.


K. Charles Janac, President and CEO, ArterisIP

Topics: new facilities software development engineering team engineering centers

ArterisIP Acquires iNoCs Software and Associated Intellectual Property Rights

Advances the next round of SoC interconnect innovation with cutting-edge software and algorithms created by iNoCs based on EPFL research

CAMPBELL, Calif. — October 19, 2017 — ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP,today announced that it has acquired exclusive rights to iNoCs’ software, hardware, and associated intellectual property. iNoCs was founded in 2007 by leading researchers in the field of network-on-chip (NoC), Giovanni De Micheli, Luca Benini, Federico Angiolini and Srinivasan Murali, to pioneer the field of topology synthesis for the then emerging NoC interconnect IP market. Antonio Pullini later joined them to bring topology placement expertise. iNoCs has developed exciting concepts, algorithms, and software that address the increasing complexity of deep submicron semiconductor interconnects. With this agreement, ArterisIP will accelerate the adoption of these innovative technologies by implementing them in its extensive product roadmap and making them available to its broad customer base.

With our involvement, ArterisIP will be able to leverage the work done by the iNoCs team in their future generation products, and build upon this technology foundation.


Giovanni De Micheli, Co-Founder, iNoCs

Topics: M&A acquisitions network-on-chip iNoCs

ArterisIP Joins GLOBALFOUNDRIES FDXcelerator Partner Program

Program enables faster development of automotive and IoT systems-on-chip (SoC)

CAMPBELL, Calif. — October 10, 2017 — ArterisIP, the innovative supplier of silicon-proven
commercial system-on-chip (SoC) interconnect IP, today announced it has joined the GLOBALFOUNDRIES FDXcelerator™ Partner Program. This program enables SoC designers to integrate ArterisIP interconnect IP into their projects with the ability to accelerate the timing closure process for FDX-based designs. The partnership speeds the development of pioneering products in applications from automotive ADAS and machine learning to small IoT processors.

The addition of ArterisIP to the FDXcelerator Partnership Program has already realized benefits with the implementation of an FD-SOI automotive ADAS multi-processor SoC with fellow FDXcelerator partner Dream Chip Technologies.


Alain Mutricy, Senior Vice President of Product Management, GLOBALFOUNDRIES

Topics: flexnoc resilience package ncore resilience package ArterisIP partner

ArterisIP announces Ncore 3 Cache Coherent Interconnect

Enables next-generation machine learning and autonomous driving SoCs with support for Arm AMBA CHI protocol, CCIX, and ISO 26262 Functional Safety

Linley Processor Conference 2017, SANTA CLARA, Calif. — October 4, 2017 — ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced the Ncore Cache Coherent Interconnect IP version 3 along with the optional Ncore Resilience Package for functional safety.

As current users of the Ncore cache coherent interconnect, we are excited about the technical innovation in ArterisIP’s new Ncore 3 IP. Enabling both the AMBA CHI and ACE protocols in the same SoC will allow for greater use of existing IP in high-performance systems.


Mr. Yu Li, Vice President , ZTE (SaneChips)

Topics: new product AMBA ACE protocol Ncore cache coherent interconnect CCIX ncore resilience package ISO 26262 certification AMBA5 CHI