The winners will be announced at an awards ceremony on Tuesday, March 27 at The Fairmont San Jose, during DESIGN West, a new UBM Electronics conference and expo that builds on the rich foundation of training, education and products available at ESC, combined with popular summits and new event launches in one venue for the first time.

“We are thrilled to be included among this year’s ACE Awards finalists,” said Kurt Shuler, Arteris Vice President of Marketing. “It’s particularly satisfying to be recognized by EE Times, EDN and UBM Electronics for our progress in making network-on-chip interconnect technology the leading choice of the top semiconductor makers. By working intimately with the industry’s most demanding and innovative customers on their toughest SoC issues since 2005, we are now in a position where the technology we pioneered has become the industry’s go-to solution for mobile phone application processors, baseband modems, gaming consoles, digital TVs and other sophisticated systems-on-chip.”

Arteris provides Network-on-Chip (NoC) interconnect IP to improve performance, timing closure, power consumption and die size of system-on-chip (SoC) devices for consumer electronics, mobile, automotive and other applications. Older monolithic bus and crossbar interconnect technologies create serious problems for architects, digital and physical designers, and integrators: massive numbers of wires, increased heat and power consumption, failed timing closure, spaghetti-like routing congestion leading to increased die area, and difficulty making changes for derivatives. To address these issues, Arteris pioneered the first commercial NoC interconnect IP product, now called Arteris® FlexNoC®, using packetization and a distributed network of small interconnect elements to address congestion, timing, power and performance issues.

Since 2005, when Charlie started at Arteris, the company went from no customers to approximately 40 semiconductor customers today. A majority of the world’s wireless mobility SoC projects executed in 2011 include Arteris FlexNoC Interconnect IP, which will lead to large production volumes in the future. While there will be 200M SoCs produced with the Arteris NoC and interchip links in 2012, the Arteris-connected SoC volume is projected to grow to over 1B units per year by 2015, based on production at companies such as Qualcomm, Samsung, Texas Instruments, Toshiba and LG Electronics.

“The new ACE Awards program, presented for the first time by both EE Times and EDN, provides us with an opportunity to recognize the technologies that have made a difference in the way we work, live and play over the past year. We congratulate the finalists on their innovations and leadership in the electronics industry. Additionally, we look forward to our awards ceremony in March to celebrate the innovation, creativity and contributions of the engineering community,” said Junko Yoshida, Editor in Chief, EE Times, UBM Electronics.

A panel of EE Times editors narrowed down the entries to five finalists in each category, based on the criteria set forth in an online submission form. Winners are determined from among the finalists by a panel of independent judges, including Robin B. Gray, Jr., Electronic Components Industry Association; Gordon Bell, Senior Researcher, Microsoft Research; Jeff Bier, President, Berkeley Design Technology, Inc. (BDTI), Founder, Embedded Vision Alliance; Larry Boucher, President and CEO, Alacritech; William Dally, Chairman, Computer Science Dept., Stanford University; Erach Desai, Consultant, DESAIsive; John East, President and CEO, Actel Corporation; Gene A. Frantz, Principal Fellow, Texas Instruments, Inc.; Lucio Lanza, Managing Director, Lanzatech Ventures; John Mashey, Consultant, Techviser; Dennis Monticelli, Chief Technoligist and Fellow, National Semiconductor; Martin Reynolds, Dataquest; George M. Scalise, President, Semiconductor Industry Association; Naveed Sherwani, President & CEO, Open Silicon; and Nick Tredennick, Editor, Gilder Technology Report. Judging took place from November 1, 2011-January 6, 2012.

About Arteris

Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs.

Founded by networking experts and offering the first commercially available Network-on-Chip IP products, Arteris operates globally with headquarters in Sunnyvale, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech. More information can be found at www.arteris.com.

About UBM Electronics

UBM Electronics is the global leader in media and marketing solutions for the electronics industry. UBM Electronics delivers results for the key influencers and decision makers involved in the design, development and commercialization of technology through its market-leading brands, peer communities and professional education services. More than 1.7 million engineering professionals engage with UBM Electronics brands which include EE Times, EDN, Design News, Test & Measurement World, TechOnline, EBN, Datasheets.com, Designlines and Embedded.com across the globe to accelerate technology sales. The international electronics community gathers at UBM Electronics market-leading events such as the Embedded Systems Conferences, DesignCon and ARM Technology Conference to share, learn, discuss, and advance the critical issues and challenges facing the electronics industry. Additionally, UBM Electronics provides end-to-end services ranging from next-generation marketing, integrated media, custom solutions and research. UBM Electronics is part of UBM (UBM.L) a global provider of media and information services for professional B2B communities and markets.