Arteris Press Releases

ArterisIP and ResilTech to Present at ISO 26262 Semiconductors Conference

Automotive IQ 1st Annual International Conference on the Application of ISO 26262 to Semiconductors (Dec. 5-7) to feature fault simulation lessons learned

CAMPBELL, Calif. and PONTEDERA, Italy — November 28, 2017 — ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, and ResilTech S.R.L., the leader in resilient computing and functional safety for automotive systems, will jointly present at Automotive IQ’s Application of ISO 26262 to Semiconductors conference on December 5th through the 7th, 2017, in Munich, Germany.

As automotive systems-on-chip increase in size and complexity, it has become increasingly important to perform safety analyses using executable models of IPs, and to define standard formats to exchange information between IP suppliers and SoC integrators.


Francesco Rossi, Automotive Safety Solution Manager, ResilTech

Topics: ISO 26262 compliance ResilTech functional safety ISO 26262 ISO 26262 specification

ArterisIP and ResilTech Announce Strategic Partnership to Facilitate ISO 26262 Compliance for Complex Autonomous Automotive Systems

Joint engineering and integration effort simplifies and accelerates ISO 26262 FMEDA and diagnostic coverage for ASIL D qualification

CAMPBELL, Calif. and PONTEDERA, Italy — June 20, 2017 — ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, and ResilTech S.R.L., the leader in resilient computing and functional safety for automotive systems, today announced a strategic partnership to help semiconductor design teams efficiently validate ISO26262 functional safety levels for automotive systems-on-chip.

Working with ArterisIP allows ResilTech to apply its automotive resilience expertise to a broad range of automotive SoC projects. Our goal is to not only provide interconnect-specific functional safety knowledge to ArterisIP automotive customers, but to also ultimately facilitate a resilience verification solution for highly complex SoCs.


Andrea Bondavalli, Senior Board Member and Co-Founder, ResilTech

Topics: ISO 26262 compliance ncore resilience package ResilTech cache coherency functional safety

Arteris FlexNoC Resilience Package Enhances Redundancy, Fault Tolerance for Mission Critical Systems-on-Chip

New technology augments network-on-chip interconnect IP, boosting reliability while improving design flexibility for automotive, aerospace and industrial electronics

CAMPBELL, California — September 30, 2014 — Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced the new FlexNoC Resilience Package designed to increase reliability and lower the cost of developing resilient and fault tolerant systems-on-chip (SoCs). The FlexNoC Resilience Package enhances the benefits of Arteris FlexNoC network-on-chip fabric IP to automotive, aerospace defense, industrial equipment and other electronics markets requiring fault tolerance.

A growing number (of OEMs and system suppliers) are turning to safety- and security-optimized network-on-chip subsystems for SoCs, such as the FlexNoC Resilience Package, to lower the development costs and the time it takes to achieve the ISO 26262 certification, enabling both media-intense processing and certifiable mission critical solutions in an integrated SoC.


Tom Hackenberg, Automotive Embedded Processors Principal Analyst, IHS Technology

Topics: functional safety ISO 26262 new product automotive