Arteris Press Releases

Arteris® IP FlexNoC® Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS

Mature network-on-chip interconnect technology enables smoother ASIL certification and time to market for AI-powered autonomous driving systems

CAMPBELL, Calif. May 14, 2019– Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Black Sesame Technologies has licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its next-generation automotive advanced driver assistance systems (ADAS) that utilize advanced artificial intelligence (AI) algorithms for autonomous driving capabilities.

Our new generation of autonomous driving systems require data protection within the on-chip NoC interconnect to meet ISO 26262 ASIL B functional safety requirements as well as extensive quality of service guarantees to meet the demanding needs of our AI hardware acceleration architecture. Arteris IP is the world leader in NoC interconnect technology and a pioneer in automotive and AI markets, and Arteris FlexNoC IP and the Resilience Package are helping us to more quickly develop our ISO 26262-compliant systems.”


David Zeng, VP of Engineering, Black Sesame

Topics: automotive semiconductors Arteris FlexNoC new customer flexnoc resilience package ADAS ISO 26262 compliance artificial intelligence

Arteris IP FlexNoC Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems

NoC interconnect enables high bandwidth and low latency on-chip communications while increasing functional safety diagnostics coverage

CAMPBELL, Calif. — March 19, 2019 Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Vayyar Imaging has licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its next-generation radio frequency (RF) 3D imaging chips for automotive systems.

Vayyar’s chip is the most advanced radar imaging SoC in the market today enabling real-time high-resolution 3D Point Cloud. Our chip requires the ability to transfer large amounts of data and make sure the highest safety standards are kept. Arteris NoC technology enables data protection mechanisms that increase the functional safety of our systems to meet the highest automotive safety standards.” 


Raviv Melamed, CEO and Co-Founder, Vayyar Imaging

Topics: SoC security new customer flexnoc resilience package ISO 26262 compliance ADAS systems RF automotive systems

ArterisIP and ResilTech to Present at ISO 26262 Semiconductors Conference

Automotive IQ 1st Annual International Conference on the Application of ISO 26262 to Semiconductors (Dec. 5-7) to feature fault simulation lessons learned

CAMPBELL, Calif. and PONTEDERA, Italy — November 28, 2017 — ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, and ResilTech S.R.L., the leader in resilient computing and functional safety for automotive systems, will jointly present at Automotive IQ’s Application of ISO 26262 to Semiconductors conference on December 5th through the 7th, 2017, in Munich, Germany.

As automotive systems-on-chip increase in size and complexity, it has become increasingly important to perform safety analyses using executable models of IPs, and to define standard formats to exchange information between IP suppliers and SoC integrators.


Francesco Rossi, Automotive Safety Solution Manager, ResilTech

Topics: functional safety ISO 26262 ResilTech ISO 26262 compliance ISO 26262 specification

ArterisIP and ResilTech Announce Strategic Partnership to Facilitate ISO 26262 Compliance for Complex Autonomous Automotive Systems

Joint engineering and integration effort simplifies and accelerates ISO 26262 FMEDA and diagnostic coverage for ASIL D qualification

CAMPBELL, Calif. and PONTEDERA, Italy — June 20, 2017 — ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, and ResilTech S.R.L., the leader in resilient computing and functional safety for automotive systems, today announced a strategic partnership to help semiconductor design teams efficiently validate ISO26262 functional safety levels for automotive systems-on-chip.

Working with ArterisIP allows ResilTech to apply its automotive resilience expertise to a broad range of automotive SoC projects. Our goal is to not only provide interconnect-specific functional safety knowledge to ArterisIP automotive customers, but to also ultimately facilitate a resilience verification solution for highly complex SoCs.


Andrea Bondavalli, Senior Board Member and Co-Founder, ResilTech

Topics: functional safety cache coherency ncore resilience package ResilTech ISO 26262 compliance