Arteris Press Releases

VIA Telecom Selects Arteris C2C High-Speed Inter-Chip
Communications IP

C2C™ Chip-to-Chip Link IP Enables Mobile Phone Baseband Memory Sharing and Lower Bill of Materials (BOM)

SUNNYVALE, California – October 25, 2011 – Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that VIA Telecom has licensed the C2C™ Chip-to-Chip Link interconnect IP solution for high speed inter-chip communication between mobile phone modem baseband chips and application processors.

The C2C interconnect IP offers us a simple solution to connect to industry-leading application processors while removing the requirement for a dedicated DRAM memory connected to our modem baseband. Customers choosing VIA’s modems will be able to experience lower overall BOM cost and easier integration.

VIA Telecom Arteris NoC
Mark Davis, Chief Technology Officer, VIA Telecom

“The C2C interconnect IP offers us a simple solution to connect to industry-leading application processors while removing the requirement for a dedicated DRAM memory connected to our modem baseband,” said Mark Davis, Chief Technology Officer of VIA Telecom. “Customers choosing VIA’s modems will be able to experience lower overall BOM cost and easier integration.”

As announced on 26 July 2011, Chip-to-Chip (C2C) is the first instance of an industry standard allowing shared memory between two chips, such as a mobile phone applications processor and a mobile phone modem. The 100ns round-trip latency of the C2C connection is fast enough for the modem to share the application processor’s RAM and to maintain enough read throughput and low latency for cache refills. This enables the phone manufacturer to remove the modem’s dedicated RAM chip from the phone’s bill of materials (BOM), saving a minimum $2 in cost per phone. 

“VIA Telecom’s implementation of C2C is affirmation of the value proposition of Arteris interchip connectivity IP products,” said K. Charles Janac, President and CEO of Arteris. “The ability of C2C to simplify communications between multiple SoCs allows semiconductor vendors to lower BOM and development costs for their customers.”

About Arteris

Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs.

Founded by networking experts and offering the first commercially available Network-on-Chip IP products, Arteris operates globally with headquarters in Sunnyvale, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech. More information can be found at www.arteris.com.

About VIA Telecom

VIA Telecom is a leading innovator and developer of highly affordable 3G CDMA2000® baseband processors used in a wide range of mobile 3G devices spanning voice, data, and GPS-enabled applications, as well as complete handset form factor reference designs and operator customization services. VIA Telecom has design centers in San Diego and Fremont, California, and Hangzhou, China, and offices in the US, Taiwan, China, Korea and India. For additional information, please visit the website at www.via-telecom.com or send an e-mail to marketing@via-telecom.com.

Arteris, FlexNoC and the Arteris logo are trademarks of Arteris. C2C™ and Chip to Chip Link™ are trademarks of Texas Instruments, Incorporated. All other product or service names are the property of their respective owners.

Editorial Contact

Kurt Shuler
Arteris Inc.
+1 408 470 7300
kurt.shuler@arteris.com

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