Feb 18, 5:00 – 6:00 PM (PST) | E-103: Advanced Packaging Solutions
Logical IP Packaging for Chiplets: Pioneering Innovation, Powering Efficiency by Charlie Janac, President & CEO at Arteris
Feb 19, 3:00 – 4:20 PM (PST) | B-202: Die-to-Die Interfaces – 6: New Approaches
Enabling Scalable Multi-Die Systems for AI, HPC, and ADAS by Ashley Stevens, Director of Product Management and Marketing at Arteris