Feb 17, 8:35 AM – 9:25 AM (PST) | Pre-Con C: Advanced Packaging Methods, GAB K
Logical IP Packaging for Chiplets: Pioneering Innovation, Powering Efficiency by Pascal Chauvet, Senior Director, SoC Solutions Group at Arteris
February 17, 1:00 PM – 2:00 PM (PST) | Pre-Conference Tutorials, GAB J
Superpanel: Best Way to Make Chiplets Work by Frank Schirrmeister, Synopsys, and Paul Borrill, Daedaelus. Joined by Ashley Stevens and other industry leaders
February 17, 6:00 PM – 8:30 PM (PST) | Pre-Conference Tutorials
Chat with the Experts: Optimizing PPA for Chiplet-Based Designs with Ashley Stevens, Director of Product Management and Marketing at Arteris
Feb 19, 3:40 PM – 4:00 PM PM (PST) | B 202: Die-to Die Interfaces – 6: New Approaches, GAMR 2
Enabling Scalable Multi-Die Systems for AI, HPC, and ADAS by Ashley Stevens, Director of Product Management and Marketing at Arteris