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Design & Reuse: Bigger Chips, More IPs, and Mounting Challenges in Addressing the Growing Complexity of SoC Design

3d cpu

The challenges faced by design teams in managing the complexity and time-to-market pressures of modern SoC designs are advancing at a record rate. Fragmented toolchains, lack of specialized expertise, and the need for smarter workflows are just some of the challenges that integrated NoC solutions help to address. However, as the industry continues to innovate, a paradigm shift in design methodologies is necessary for companies to stay competitive.

EDN: SoC design: What’s next for NoCs?

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NoC technology continues to advance. First-generation NoCs required manual layout and implementation. Later generations introduced physical awareness. Next-gen solutions must accelerate productivity and advance results with smart automation.

Key Observations from CES 2025 – a CMO’s Perspective

blog ces 2025

Michal Siwinski, CMO at Arteris, attended CES 2025 and collected his reflections on the major highlights, including AI’s dominance, sustainability trends, smart appliances, and how the latest NoC IP technology is helping empower the future.

SemiWiki: MCUs Are Now Embracing Mainstream NoCs

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MCUs are evolving beyond traditional roles, now incorporating AI, safety, and communication support, blurring the distinction between MCUs and SoCs. Power reduction and safety compliance are driving the adoption of NoCs in MCUs, necessitating advanced network designs to support complex requirements.

Semiconductor Engineering: Scaling AI Chip Design With NoC Soft Tiling

Reusing pre verified soft tiles

As AI workloads continue to grow in scale and complexity, NoC soft tiling offers a flexible, scalable and power-efficient solution for complex SoC and derivative designs. By simplifying integration, optimizing performance and enabling the dynamic reuse of pre-verified tiles, soft tiling is set to shape the future of AI-driven semiconductor innovation.

Semiconductor Engineering: Reducing SoC Power With NoCs And Caches

Socs multiple clock power domains

The growing complexity of integrating multiple processing elements, memory systems and communication interfaces into a single SoC demands innovative solutions to optimize power efficiency. Arteris offers a comprehensive suite of IP products, including FlexNoC, Ncore and CodaCache that address these challenges.