Electronic Design: Speeding the Process of Building IPs, Chiplets, and SoCs
- Arteris
- < 1 min read
Today’s system-on-chip (SoC) devices are constantly increasing in both size and complexity, often incorporating thousands of intellectual-property (IP) blocks, each containing millions or even billions of transistors. Creating systems of this size and sophistication is mindbogglingly complicated.
To overcome limitations in reticle size and improve yield and scalability, many designs are now disaggregated into multiple dies, or chiplets, that together form a multi-die system within a single package. This rapid growth is driven by the escalating requirements of modern applications. They demand increased processing power and tighter system integration, especially in areas such as artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC).
Another consideration is that SoCs encompass a complex blend of hardware and software components, tightly coupled to deliver high performance, efficiency, and flexibility. The physical manifestation of the hardware-software interface (HSI) is embodied by control and status registers (CSRs) located in the IPs.
The number of CSRs in IPs, SoCs, chiplets, and multi-die systems varies enormously depending on scale and functionality. To provide one point of reference, a high-end SoC can have anywhere from 200K to over 5 million CSRs, each containing multiple fields and bits.
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