Semiconductor Engineering: Megatrends At DAC

Frank Schirrmeister, VP Solutions & Business Development at Arteris talks to Ann Mutschler from Semiconductor Engineering in this video interview.

July 17th, 2023

Spotting key trends over three days of a semiconductor design conference is a challenge, but some important ones come into focus after attending multiple sessions — AI/ML, chiplet integration, and heterogeneous integration in an SoC and package. Frank Schirrmeister, vice president solutions and business development at Arteris IP, talks about a variety of topics that fit under the DAC umbrella, including everything from memory tagging to RISC-V and optimism about new talent.

To read the full article on Semiconductor Engineering, click here.

Topics: SoC IP System-on-Chip NoC network-on-chip Semiconductor Engineering Semiconductors AIP Arteris design automation conference DAC