Arteris Articles

Semiconductor Engineering: Data Explosion Pushes Boundaries of IC Interconnects

Benoit de Lescure, CTO at Arteris IP is quoted in this new article in Semiconductor Engineering:

Data Explosion Pushes Boundaries of IC Interconnects

September 22nd, 2021 - By Ann Steffora Mutschler

Design teams rethink the movement of data on-chip, off-chip, and between chips in a package.


“As chips become extremely large, the interconnect is touching all of the IP blocks in the chip. Benoit de Lescure, CTO at Arteris IP. “In this way, the interconnect is growing like the chip. Other components are not. A PCI controller will stay a PCI controller, but the interconnect size grows along with the size of the chip ,so there are scalability issues, especially because designing a good interconnect requires an understanding of how it will be implemented physically. How will it connect all those components on the chip? What amount of free space on the die will be left for the interconnect to use? What switch topology are you going to implement so that the physical aspects are easier later on? As the size of the problem grows bigger, it becomes significantly more difficult to come up with good interconnect decisions.”

Topics: Interconnect autonomous driving semiconductor engineering arteris ip Benoit de Lescure SoCs kurt shuler PHY scalability floorplan PCI controller switch topology D2D digital controller

Semiconductor Engineering: Long-Haul Trucking With Fewer Drivers

Kurt Shuler, Vice President of Marketing at Arteris IP is quoted in this new article in Semiconductor Engineering:

Long-Haul Trucking With Fewer Drivers

September 13th, 2021 - By Ann Steffora Mutschler

The economics are compelling, but technology challenges abound that are unique to this market.


Interestingly, when Intel-owned Mobileye started out with its technology, the first market was aftermarket selling to trucks. “The idea was that — and it was true — if you purchase this Mobileye system and install that in your fleet of trucks, your insurance would go down,” said Kurt Shuler, vice president of marketing at Arteris IP. “That was the value proposition, and it retrofitted these capabilities onto these trucks. There’s a lot of liability with these trucks when there’s an accident. That’s why companies like FedEx Ground, and Amazon, instead of doing like UPS and saying, ‘These trucks are part of our fleet. We own them,’ they’re independent contractors. And so if your Amazon delivery or your FedEx Ground delivery crashes at FedEx, it’s the responsibility of the contractor because of the liability around that. There are incentives in the economics for these kinds of things to add the capabilities.”

Topics: automotive ADAS mobileye ArterisIP autonomous driving semiconductor engineering arteris ip SoCs kurt shuler EDA autonomous trucking

Semiconductor Engineering: Auto OEMs Face New Competitive Threats

Kurt Shuler, Vice President of Marketing at Arteris IP is quoted in this new Semiconductor Engineering article:

Auto OEMs Face New Competitive Threats

March 4th, 2021 - By Ann Steffora Mutschler

EVs are creating openings for non-traditional players, creating havoc in the supply chain.

Indeed, changes in the thinking of automotive OEMs have been evident for at least the past five years, when it was clear that the OEMs intended to start making their own chips — ironically to avoid becoming “the Foxconn of cars,” said Kurt Shuler, vice president of marketing at Arteris IP. “Foxconn does things to spec. But the ideas, the intellectual property, the value-added content reside outside. The ODM lives off of very tiny margins. For the Tier 1s, they’ve always been the specialist in mechanical or hydraulic, traditional automotive electronics, things like that. And now they’re seeing that they’re getting attacked from below from their own suppliers, as the chip guys — Infineon, NXP, and others — start to create reference design systems with their own silicon that can be adopted by a Tier 1. But an OEM also could buy that directly and do their own software. So the Tier 1s also are getting attacked from above by the OEMs.”

Topics: SoC NoC network-on-chip automotive ADAS autonomous driving semiconductor engineering arteris ip interconnects kurt shuler EV Tier 1s ODM

SemiWiki: Where's the Value in Next-Gen Cars?

Bernard Murphy learns more from Kurt Shuler on the shifting landscape in the automotive electronics value chain in this new SemiWiki blog:

Where's the Value in Next-Gen Cars?

June 22th, 2020 - By Bernard Murphy

Value chains can be very robust and seemingly unbreakable – until they’re not. One we’ve taken for granted for many years is the chain for electronics systems in cars. The auto OEM, e.g. Toyota, gets electronics module from a Tier-1 supplier such as Denso. They, in turn, build their modules using chips from a semiconductor chip maker such as Renesas, who produces their chips using pre-packaged functions from IP providers like Arm. Toyota could do the whole thing themselves, but it’s very expensive to set-up and maintain all of that infrastructure. Specialization makes it all more practical. Everyone makes money doing their bit well and cost-effectively and being able to sell to multiple customers (Toyota, GM, BMW, etc.). However, that cash flow can be upended when disruptive innovations are thrown into the supply chain, in this case, a lot more intelligence and autonomy. I talked to Kurt Shuler (VP Marketing at Arteris IP) to get his view. Kurt is an IP supplier and has a unique viewpoint because he works with semis, Tier-1s and OEMs, with standard designs as well as newer AI-based designs. He’s also an active member of the ISO 26262 committee.

 

 

Topics: SoC ISO 26262 semiconductor Ncore mobileye FlexNoC autonomous driving AI semiwiki kurt shuler noc interconnect Tier 1s value-chain