Arteris Articles

Semiconductor Engineering: CEO Outlook: 2021

K. Charles Janac, President and CEO of Arteris IP comments in today's Semiconductor Engineering blog:

CEO Outlook: 2021 

January 4th, 2021 - By Ed Sperling

The semiconductor industry will look and behave differently this year, and not just because of the pandemic.

"Chiplets will become increasingly important", said K. Charles Janac, president and CEO of Arteris IP. "Some will be for specific functions. Some will require specialized processors. But to make all of this work, the interconnects will need to become even more sophisticated than they are today. The good thing about the interconnect is there are almost unlimited innovation possibilities. There are a lot of ways to add value.”

Topics: SoC Interconnect NoC automotive semiconductor engineering K. Charles Janac chiplets chip architectures hard ip blocks chipmakers

Semiconductor Engineering: A Renaissance For Semiconductors

Kurt Shuler, Vice President of Marketing at Arteris IP is quoted in this new article in Semiconductor Engineering:

A Renaissance For Semiconductors

October 28th, 2020 - By Brian Bailey

New horizontal technologies and vertical markets are fueling the opportunities for massive innovation throughout an expanding ecosystem.

Even within artificial intelligence there are multiple facets to the problem. “From an SoC architecture standpoint, think of a 2 x 2 matrix where you have data center versus edge on one side,” says Kurt Shuler, vice president of marketing at Arteris IP. “People may argue about where the dividing line is, but you could think of it as stuff that runs off a battery versus stuff that has to be plugged in. The other side is artificial intelligence, and there are two aspects to that. One is training the neural network, and the other is using that neural network in the real world — inference. So you have this 2 x 2 matrix of data center versus edge, and training versus inference.

Topics: SoC NoC software automotive semiconductor engineering soc architecture interconnects kurt shuler noc interconnect chiplets 5G IP market chips

Semiconductor Engineering: The Race To Multi-Domain SoCs

 Arteris IP's CEO looks at how automotive and AI are Altering chip design in this article in Semiconductor Engineering;

The Race To Multi-Domain SoCs

February 7th,  2019 - By Ed Sperling

K. Charles Janac, president and CEO of Arteris IP, sat
down with Semiconductor Engineering to discuss the impact of automotive and AI on chip design. What follows are excerpts of that conversation.

SE: What do you see as the biggest changes over the next 12 to 24 months?
Janac: There are segments of the semiconductor market that are shrinking, such as DTV and simple IoT. Others are going through an investment phase, including automotive, AI/machine learning and China. You really want to be focused on those segments. 

SE: So does IP that’s being developed today look radically different than it did five years ago?
Yes, everything is getting amazingly complex. What people are building right now are multi-domain SoCs. The CPU, which used to do all the work, does relatively less work. There are accelerators for vision and data analysis outside of the CPU subsystem. There are machine learning sections, some general-purpose, some very specific, all on-chip. There is a memory subsystem with very high-bandwidth memory and low latency. There also is functional safety. You need tremendous performance because a car is a supercomputer on wheels. The car has to be very efficient, because you need to deliver that compute power without water cooling. Power management becomes very sophisticated. And then there are functional safety and security subsystems to keep these safe from environmental and man-made issues.

SE: Where does the network on chip (NoC) fit into all of this?
Janac: All data goes through the NoC of the chip. There are opportunities for generating value from that. But the increase in complexity is increasing the number and sophistication of the interconnect parts of the chip. Before, you may have had networks on chip. Now you may have 20 or 30.

Topics: semiconductor automotive ADAS neural networks AI LIDAR flexnoc ai package noc interconnect ML AI SoC Designers chiplets