Arteris Articles

Semiconductor Engineering: Auto OEMs Face New Competitive Threats

Kurt Shuler, Vice President of Marketing at Arteris IP is quoted in this new Semiconductor Engineering article:

Auto OEMs Face New Competitive Threats

March 4th, 2021 - By Ann Steffora Mutschler

EVs are creating openings for non-traditional players, creating havoc in the supply chain.

Indeed, changes in the thinking of automotive OEMs have been evident for at least the past five years, when it was clear that the OEMs intended to start making their own chips — ironically to avoid becoming “the Foxconn of cars,” said Kurt Shuler, vice president of marketing at Arteris IP. “Foxconn does things to spec. But the ideas, the intellectual property, the value-added content reside outside. The ODM lives off of very tiny margins. For the Tier 1s, they’ve always been the specialist in mechanical or hydraulic, traditional automotive electronics, things like that. And now they’re seeing that they’re getting attacked from below from their own suppliers, as the chip guys — Infineon, NXP, and others — start to create reference design systems with their own silicon that can be adopted by a Tier 1. But an OEM also could buy that directly and do their own software. So the Tier 1s also are getting attacked from above by the OEMs.”

Topics: SoC NoC network-on-chip automotive ADAS autonomous driving semiconductor engineering arteris ip interconnects kurt shuler EV Tier 1s ODM

Semiconductor Engineering: Make Your Own Energy

 Arteris IP's Kurt Shuler, Vice President of Marketing, quoted in the latest Semiconductor Engineering article.

Make Your Own Energy

May 2nd, 2019 - By Ann Steffora Mutschler

Efficient use of power and energy in electric vehicles and smart buildings will require innovative thinking. 

Where it works
Energy harvesting has been important to automotive systems, but not necessarily at the SoC level, said Kurt Shuler, vice president of marketing at Arteris IP. “In EV and hybrid automotive systems, regenerative braking is common and there’s efforts to harvest vibrational energy using piezoelectric transducer MEMS, but this technology will take a while to become mainstream.”

At the SoC level, the first place Arteris IP saw energy harvesting implemented was in 2014 with TI’s SimpleLink CC26xx energy-sipping IoT chips, which are designed to be powered by a separate MEMS-based power source. Even though these chips are relatively simple SoCs from a processing viewpoint, Shuler stressed that they are hugely complex from a power management standpoint. There are more than 20 different power and voltage domains along with dynamic voltage frequency scaling.

For more information, please download the Arteris FlexNoC Interconnect IP data sheet; https://www.arteris.com/download-flexnoc-datasheet

Topics: SoC automotive semiconductor engineering noc interconnect automotive systems EV hybrid