I've received a lot of feedback on the "Interchip Connectivity: HSIC, UniPro, HSI, C2C, LLI...oh my!" article I wrote last year and I thank everyone for their feedback!
by Kurt Shuler, on Thu, May 17, 2012 @ 09:07 AM
I've received a lot of feedback on the "Interchip Connectivity: HSIC, UniPro, HSI, C2C, LLI...oh my!" article I wrote last year and I thank everyone for their feedback!
by Kurt Shuler, on Tue, Jan 17, 2012 @ 11:07 AM
Two new options for interchip connectivity are available today that enable sharing a DRAM memory between two chips for data and programs. These standards, called MIPI Low Latency Interface (MIPI LLI) and Chip-to-Chip (C2C), are primarily targeted at mobile phones, where a mobile phone’s modem usually requires its own discreet DRAM. With either C2C or MIPI LLI, the mobile phone modem can use the application processor’s DRAM though a low-latency, memory-mapped connection that requires no software drivers or runtime software.
by Kurt Shuler, on Thu, Mar 31, 2011 @ 10:30 AM
There has been a lot of confusion about the different standards for interchip connectivity, with many hardware developers of consumer electronics and mobile computing systems-on-chip wondering what to use. As an interconnect IP provider, I struggle with this every day when working with our customers. I wrote this article to share what I have learned.
by Kurt Shuler, on Fri, Mar 04, 2011 @ 12:11 PM
TI has placed extensive information on their new OMAP5430 and OMAP5432 processors on their web page: http://www.ti.com/ww/en/omap/omap5/omap5-OMAP5430.html
News and original writing about on-chip interconnects, on-chip communications and the semiconductor intellectual property ("semi IP") industry.
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