Arteris Articles

Semiconductor Engineering: Software-Hardware Co-Design Becomes Real

Michael Frank, Fellow and System Architect at Arteris IP is quoted in this new article in Semiconductor Engineering:

Software-Hardware Co-Design Becomes Real

September 27th, 2021 - By Brian Bailey

Automatic mapping of software onto existing hardware, or using software to drive hardware design, are highly desired but very difficult.


“Hardware/software co-design has been happening for quite a while,” says Michael Frank, fellow and system architect at Arteris IP. “People have been trying to estimate the behavior of the platform and evaluation its performance using real software for quite a while. The industry has been building better simulators, such as Gem5, and Qemu. This has extended into systems where accelerators have been included, where you build models of accelerators and offload your CPUs by running parts of the code on the accelerator."

Topics: Interconnect automotive semiconductor engineering arteris ip CPUs SoCs chip design AI/ML Michael Frank Gem5

Semiconductor Engineering: HBM Takes On A Much Bigger Role

Michael Frank, Fellow and System Architect at Arteris IP is quoted in this new article in Semiconductor Engineering:

HBM Takes On A Much Bigger Role

May 13th, 2021 - By Brian Bailey

High-bandwidth memory may be a significant gateway technology that allows the industry to make a controlled transition to true 3D design and assembly.

“The benefit of HBM is really its high bandwidth,” says Michael Frank, fellow and system architect at Arteris IP. “If you have a working data set that fits, it’s fine. To consume that much bandwidth, you are likely to use a decent amount of silicon area to process it. But HBM does not providing the low latency that you get from SRAMs. You have to look at your application. What is your algorithm? In many systems, you sequentially process a lot of data, mostly with the same kind of processing scheme. It’s like SIMD or streaming. Machine learning is typically something like this, where you have large data sets and weights. But HBM is still limited in capacity, and the price is relatively high.”

Topics: SoC NoC network-on-chip machine learning semiconductor engineering arteris ip interconnects Michael Frank DRAMS SMID

Semiconductor Engineering: Many Chiplet Challenges Ahead

Michael Frank, fellow and system architect at Arteris IP is quoted in this new Semiconductor Engineering article:

Many Chiplet Challenges Ahead

April 12th, 2021 - By Brian Bailey

Assembling systems from physical IP gaining mindshare, but there are technical, business and logistical issues that need to be resolved before this will work.

“The size of the bits and pieces is an issue,” says Michael Frank, fellow and system architect at Arteris IP. “It is perhaps less of an issue with chiplets or 2.5D, where things are mounted on a substrate, but it adds additional challenges for 3D. We are no longer dealing with gravel. It is grains of sand, or even dust specs. It’s more robust to build boards.”

Topics: SoC NoC network-on-chip semiconductor engineering arteris ip interconnects chiplets Michael Frank 5nm ESD

Semiconductor Engineering: More Data Drives Focus On IC Energy Efficiency

Michael Frank, fellow and system architect at Arteris IP are quoted in this new Semiconductor Engineering article:

More Data Drives Focus On IC Energy Efficiency

April 8th, 2021 - By Ann Steffora Mutschler

Decisions that affect how, when, and where data gets processed.

"On the chip side, it’s an engineering discipline. On the other side are the algorithm experts who understand what the masks are and what they want to do,” said Michael Frank, fellow and system architect at Arteris IP.

Topics: SoC NoC network-on-chip machine learning neural networks semiconductor engineering arteris ip interconnects chiplets Michael Frank memory architecture TensorFlow