Arteris Articles

Semiconductor Engineering: HBM Takes On A Much Bigger Role

Michael Frank, Fellow and System Architect at Arteris IP is quoted in this new article in Semiconductor Engineering:

HBM Takes On A Much Bigger Role

May 13th, 2021 - By Brian Bailey

High-bandwidth memory may be a significant gateway technology that allows the industry to make a controlled transition to true 3D design and assembly.

“The benefit of HBM is really its high bandwidth,” says Michael Frank, fellow and system architect at Arteris IP. “If you have a working data set that fits, it’s fine. To consume that much bandwidth, you are likely to use a decent amount of silicon area to process it. But HBM does not providing the low latency that you get from SRAMs. You have to look at your application. What is your algorithm? In many systems, you sequentially process a lot of data, mostly with the same kind of processing scheme. It’s like SIMD or streaming. Machine learning is typically something like this, where you have large data sets and weights. But HBM is still limited in capacity, and the price is relatively high.”

Topics: SoC NoC network-on-chip machine learning semiconductor engineering arteris ip interconnects Michael Frank DRAMS SMID

Semiconductor Engineering: Many Chiplet Challenges Ahead

Michael Frank, fellow and system architect at Arteris IP is quoted in this new Semiconductor Engineering article:

Many Chiplet Challenges Ahead

April 12th, 2021 - By Brian Bailey

Assembling systems from physical IP gaining mindshare, but there are technical, business and logistical issues that need to be resolved before this will work.

“The size of the bits and pieces is an issue,” says Michael Frank, fellow and system architect at Arteris IP. “It is perhaps less of an issue with chiplets or 2.5D, where things are mounted on a substrate, but it adds additional challenges for 3D. We are no longer dealing with gravel. It is grains of sand, or even dust specs. It’s more robust to build boards.”

Topics: SoC NoC network-on-chip semiconductor engineering arteris ip interconnects chiplets Michael Frank 5nm ESD

Semiconductor Engineering: More Data Drives Focus On IC Energy Efficiency

Michael Frank, fellow and system architect at Arteris IP are quoted in this new Semiconductor Engineering article:

More Data Drives Focus On IC Energy Efficiency

April 8th, 2021 - By Ann Steffora Mutschler

Decisions that affect how, when, and where data gets processed.

"On the chip side, it’s an engineering discipline. On the other side are the algorithm experts who understand what the masks are and what they want to do,” said Michael Frank, fellow and system architect at Arteris IP.

Topics: SoC NoC network-on-chip machine learning neural networks semiconductor engineering arteris ip interconnects chiplets Michael Frank memory architecture TensorFlow

Semiconductor Engineering: Domain-Specific Memory

Michael Frank, Fellow and System Architect at Arteris IP is quoted in this new Semiconductor Engineering article:

Domain-Specific Memory

March 11th, 2021 - By Brian Bailey

Rethinking fundamental approaches to memory could have a huge impact on performance.

“Remember video memories — DRAM with built-in shift registers?” asks Michael Frank, fellow and system architect at Arteris IP. “Perhaps GDDR [1-5], special cache tag memories, or associative memories back in the days of TTL? A lot of these have not really survived because their functionality was too specific. They targeted a unique device. You need a large enough domain, and you are fighting against the low cost of today’s DRAM, which has the benefit of high volume and large-scale manufacturing.”

Topics: SoC NoC network-on-chip semiconductor engineering arteris ip GPUs cache DRAM interconnects Michael Frank HBM