Arteris Articles

Semiconductor Engineering: Data Explosion Pushes Boundaries of IC Interconnects

Benoit de Lescure, CTO at Arteris IP is quoted in this new article in Semiconductor Engineering:

Data Explosion Pushes Boundaries of IC Interconnects

September 22nd, 2021 - By Ann Steffora Mutschler

Design teams rethink the movement of data on-chip, off-chip, and between chips in a package.

“As chips become extremely large, the interconnect is touching all of the IP blocks in the chip. Benoit de Lescure, CTO at Arteris IP. “In this way, the interconnect is growing like the chip. Other components are not. A PCI controller will stay a PCI controller, but the interconnect size grows along with the size of the chip ,so there are scalability issues, especially because designing a good interconnect requires an understanding of how it will be implemented physically. How will it connect all those components on the chip? What amount of free space on the die will be left for the interconnect to use? What switch topology are you going to implement so that the physical aspects are easier later on? As the size of the problem grows bigger, it becomes significantly more difficult to come up with good interconnect decisions.”

Topics: Interconnect autonomous driving semiconductor engineering arteris ip Benoit de Lescure SoCs kurt shuler PHY scalability floorplan PCI controller switch topology D2D digital controller

Semiconductor Engineering: Building Your Own NoC and The Hazards of (Not) Changing

Kurt Shuler, vice president of marketing at Arteris IP authored this new  Semiconductor Engineering article about the perennial challenge that all R&D organizations face.

Building Your Own NoC and The Hazards of (Not) Changing

June 4th, 2020 - By Kurt Shuler

Sometimes, designing IP in-house runs the risk of higher cost of development and being late to market.
It is important to keep your eye on the prize, which is to get products to market profitably and quickly with the highest possible quality and value.
This is especially true for make-versus-buy decisions. You make decisions and you work with those decisions, then three years later markets have changed and new requirements have risen to the top of your list of priorities. You need to have everyone working on these new high priorities; whatever slipped down the list must be outsourced. It is crucial to develop a flexible infrastructure and methodologies to respond to ever changing market requirements.
Note: You can download the NoC Financial Calculator referenced in the article here:
  Download NoC IP Make vs. Buy Calculator
Topics: SoC ttm time to market automotive FlexNoC NoC technology semiconductor engineering safety kurt shuler noc interconnect IP market scalability