Mobileye
We have worked with Arteris NoC technology since 2010, and are excited that Arteris has brought its significant engineering prowess to help solve the problems of fault tolerant and reliable SoC design.
Elchanan Rushinek, Vice President of Engineering, Mobileye
Samsung
Using Arteris FlexNoC allows us to reduce development time and manage project risk. FlexNoC’s advanced quality-of-service and debugging features, combined with its multi-protocol support, allow Samsung SUHD TVs to reduce power consumption and die area for complex chips with more than 100 IP interfaces.
HaeJoo Jeong, Vice President, Visual Display Business, Samsung Electronics
Altera
Altera SoC FPGAs are architected to ensure customers have a solid foundation upon which to build their embedded systems, and using Arteris’ network-on-chip IP has helped us create a superior SoC FPGA. The Arteris FlexNoC Resilience IP will make it easier for Altera to implement more dependable SoC FPGAs for fault tolerant systems in the future.
Ty Garibay, Vice President of Silicon Systems Development, Altera
Renesas Electronics
Arteris FlexNoC fabric IP has been our choice for SoC development since 2008. The data protection and redundancy features included in the FlexNoC Resilience Package will help us design and implement our fault tolerant SoCs faster and at a higher quality level than possible before.
Matthias Voigt, General Manager, Engineering Group, Renesas Electronics Europe
Megachips
From our experience with Arteris’ NoC technology over the years, we knew that Arteris FlexNoC IP was the fastest interconnect fabric for SoCs with multiple initiator and target IP blocks. However, we were surprised that FlexNoC could continue to run at fast design frequencies with a significantly lower gate count and less power consumption than alternative bus fabrics.
Gen Sasaki, General Manager of Division No.2, MegaChips Corporation
Mobileye
Arteris’ network-on-chip interconnect IP allows us to reduce the die size of Mobileye's 3rd generation vision processor, EyeQ3, optimize latency for critical IP blocks and reach timing closure much sooner than expected.
Elchanan Rushinek, Vice President of Engineering, Mobileye
Mobileye
We exhaustively benchmarked the Arteris NoC interconnect IP against the competition. We need real-time performance with extremely low latency between video IP blocks, and we found the Arteris NoC to be the best solution for EyeQ3. Furthermore, we found Arteris’ memory scheduler to be superior, with excellent Quality of Service in a smaller die area. With Arteris, our customers can be assured of responsiveness and reliability to help reduce collisions and make roads safer.
Elchanan Rushinek, Vice President of Engineering, Mobileye
Mobileye
With Arteris, our customers can be assured of responsiveness and reliability to help reduce collisions and make roads safer.
Elchanan Rushinek, Vice President of Engineering, Mobileye
Mobileye
Arteris’ integrated interconnect configuration tool suite made it easy for us to quickly iterate through different topology and QoS options. Our engineers are very productive using the Arteris tools. We can now quickly find the root cause for timing issues by reviewing the Arteris FlexExplorer simulation results, then determine whether we want to add a pipeline or register slice at a specific location in the interconnect, change the topology, or change QoS or protocol parameters.
Elchanan Rushinek, Vice President of Engineering, Mobileye
Mobileye
Finding the root cause of timing issues, determining the solution, then implementing it used to take days and sometimes weeks. We are now able to solve these issues in hours. This huge reduction in troubleshooting and problem resolution time frees us up to work on other aspects of the SoC.
Netanel Zeevi, ASIC Engineer, Mobileye
Socle
Our customers require the latest, most advanced technology and the Arteris FlexNoC interconnect IP is a necessary addition to our portfolio. Acquiring the FlexNoC license strengthens our technology platform and design services offerings, and provides our customers with more options to future-proof their solutions.
Stone Peng, President and CEO, Socle Technology
Samsung
The Arteris interconnect IP offers us a convenient solution to handle the high speed communication needed between our SoC and external modem IC. Our customers will benefit from the lower BOM cost and power consumption as a result of this IP. We look forward to Arteris’ interconnect IP helping us shorten development schedules and lower risks associated with compatibility.
Thomas Kim, Vice President, SoC Platform Development, System LSI, Samsung Electronics
Toshiba
As a result of our thorough evaluation, we know the Arteris FlexNoC interconnect IP will help us shorten development schedules and increase product performance, while simultaneously decreasing costs due to back-end wire routing congestion and timing closure issues.
Yukihiro Urakawa, Senior Manager, Logic LSI Division of Semiconductor & Storage Products Company, Toshiba Corporation
Toshiba
Using the built-in FlexExplorer simulation capabilities, we were able to try many candidate architectures and configurations in very short turn-around-times. This enabled us to quickly optimize our SoC by implementing FlexNoC’s many advanced features. We were able to meet all functional, performance, area and frequency requirements without suffering any backend layout or timing issues. Using FlexNoC IP was key to our team’s success.
Yasunori Maki, Senior Manager, Lifestyle Solutions Development Center, Toshiba Corporation
TSMC
TSMC chose to work with Arteris on the interposer based test chip program because its interconnect technology is ideally suited to addressing the SoC wire routing congestion and timing closure challenges. TSMC and Arteris are working together to make it easier for our joint customers to adopt these technologies.
Suk Lee, Director of Design Infrastructure Marketing, TSMC
Rambus
By incorporating Arteris FlexNoC interconnect IP into our development programs, we are able to streamline our overall design time. This solution also provides us with flexibility to create derivations of our offerings to quickly adapt to changing market needs.
Mike Uhler, Vice President, Emerging Solutions Division, Rambus
Sckipio
Using Arteris helped Sckipio to be the first to market with G.fast products. We chose FlexNoC fabric IP because we wanted to be the first to provide built-in, high performance vectoring across a large number of high bandwidth lines while maintaining low latency.
Ron Stereson, Vice President of R&D, Sckipio
Tom Hackenberg, IHS Technology
A growing number (of OEMs and system suppliers) are turning to safety- and security-optimized network-on-chip subsystems for SoCs, such as the FlexNoC Resilience Package, to lower the development costs and the time it takes to achieve the ISO 26262 certification, enabling both media-intense processing and certifiable mission critical solutions in an integrated SoC.
Tom Hackenberg, Automotive Embedded Processors Principal Analyst, IHS Technology
Hisense
Arteris FlexNoC gives Hisense the flexibility to quickly integrate the latest hardware and software features into our SoC platforms, allowing us to bring our products to market quicker than the competition.
Shawn Zhong, CEO of SJ Microelectronics Inc., Hisense Group
InfoTM
After our investigation, we saw that Arteris FlexNoC was the best SoC fabric technology that would provide dual channel memory support and address high speed routing congestion issues.
Kurt Zhang, Product Director, Shanghai InfoTM Microelectronics
Global Unichip Corporation (GUC)
Our evaluation of Arteris FlexNoC was extremely quick, and received very positive results in routing and timing closure. Using FlexNoC creates unique time and cost advantages for us and our customers.
Ching-Che Liang, Senior Vice President of R&D, GUC
Spreadtrum
Arteris FlexNoC provides an advantage in improving system efficiency and shortening the development cycle of smartphone SoCs.
Dr. Leo Li, CEO, Spreadtrum
Freescale
Our successful adoption of Arteris FlexNoC fabric IP has been straightforward, allowing us to more quickly architect and implement sophisticated systems-on-chip in less time and with better power consumption and performance.
Fares Bagh, Vice President of R&D, Freescale
Freescale
Arteris NoC technology enables wide on-chip bandwidth with fewer wires and lower latency than traditional bus and crossbar fabrics. This multiuse deal is expected to help us deliver these benefits more quickly to engineering teams throughout Freescale.
Fares Bagh, Vice President of R&D, Freescale
Jim McGregor, TIRIAS Research
Arteris continues to advance network-on-chip technology with the FlexNoC Composition feature. FlexNoC Composition should enable design teams to dramatically improve SoC design partitioning - speeding development time and increasing parallel subsystems.
Jim McGregor, Principal Analyst, TIRIAS Research
Sckipio
The Arteris FlexNoC technology helps us get the most out of our design and development phase. FlexNoC fabric IP speeds our time to market – and lets us make mission-critical changes at the very end of the design process. This reduced risk gives us confidence that our products will be right every time.
Ron Stereson, Vice President of R&D, Sckipio
Renesas
FlexNoC interconnect IP allowed us to dramatically increase MCU performance and functionality with no impact on die area while significantly decreasing power consumption.
Andreas Papliolios, Director of IoT Silicon, Renesas Electronics America
Renesas
We rely upon FlexNoC’s integrated probing and observability features to make defect-free SoCs. And with FlexNoC’s integrated IP and tool suite, we can show our customers that their use cases are satisfied and offer them earlier software validation because of FlexNoC’s embedded debugging and probing features.
Horst Rieger, Engineering Manager, Renesas Electronics Europe
Schneider Electric
Arteris and their team of engineers delivered a product that exceeded our expectations. Our previous experience with commercial fabric IP involved numerous defects so we were extremely pleased with Arteris’ NoC technology, level of support and product quality.
Patrice Jaraudias, ASIC Design Manager, Schneider Electric
Access Network Technology (Fujitsu)
After conducting internal benchmark testing between Arteris and other solutions, we proved that FlexNoC delivered improved performance with reduced power consumption. In addition, the design flexibility and shortened development time made Arteris the clear winner for our LTE platform.
Minoru Sakata, President, Access Network Technology
IC-LOGIC
IC-LOGIC chose FlexNoC and C2C to create a flexible and high speed communication chip to respond to the increasing demand of high speed connectivity in car infotainment systems. This is yet another ‘first time right’ device by IC-LOGIC’s industry leading team of automotive and industrial semiconductor designers that establishes a new speed record for design to production, delivering a field-hardened chip that will withstand our customers’ rigorous demands.
Martin Damrau, founder and CEO, IC-LOGIC
Rockchip
Our extensive use of Arteris FlexNoC interconnect IP has enabled us to increase the number of complex SoC designs we can implement in a year, with the same amount of resources. We are always looking for ways to differentiate our product portfolio, and our collaboration with Arteris is a key factor in enabling us to be both technology and time-to-market leaders with advanced designs.
Li Shiqin, IC Design Director, Rockchip
Rockchip
Arteris has provided exceptional support to our teams, giving us the confidence to implement the FlexNoC solution in our critical Smartphone SoC platform.
Li Shiqin, IC Design Manager, Rockchip
Allwinner
The Arteris FlexNoC commercial SoC interconnect fabric IP gives us the performance required by our customers. We have seen first-hand how the interconnect IP improves process flow and overall system performance.
Ding Ran, CTO, Allwinner Technology
CSR
CSR's platform SoC solutions enable its customers to deliver a superior and differentiated user experience. With the Arteris FlexNoC interconnect IP, we have confidence that our designers will achieve improved performance and design flexibility for our Automotive and Imaging SoC products.
Dr. Steven D. Gray, CTO, CSR
Will Strauss, Forward Concepts
Arteris is staking its claim as one of the companies helping leaders to improve upon their success in bringing market dominating application processors and LTE modems into popular systems and devices.
Will Strauss, President, Forward Concepts
Altera
After a complete evaluation of available interconnect fabric IP products, Arteris FlexNoC was the clear choice. FlexNoC is the only SoC fabric that allows us to meet tight timing margins and achieve design frequency requirements. We are pleased with the increased productivity our design team has experienced using FlexNoC.
Ty Garibay, Vice President of Silicon Systems Development, Altera
RDA Microelectronics
The Arteris FlexNoC commercial SoC interconnect fabric IP meets the performance metrics established by our mobile phone customers. These results gave us the confidence to implement the solution in our critical Smartphone SoC platform. We have very high expectations and feel confident that Arteris will meet our needs.
Vincent Tai, Chairman and CEO, RDA
Rockchip
Arteris exceeded our expectations on the previous multi-core SoC platform, delivering exceptional performance and design efficiency. Arteris FlexNoC interconnect IP enables us to exceed our design frequency and power requirements while giving us more flexibility than possible using older interconnect technologies, like buses and crossbars.
Li Shiqin, IC Design Manager, Rockchip
Sequans
Arteris FlexNoC’s development efficiency benefits give us an advantage over our competitors because we can get our product to market sooner with more features and at a higher quality level.
Bertrand Debray, COO and founder, Sequans Communications
Texas Instruments
FlexNoC’s power management features and low latency helped us create the lowest-power IoT communication devices in the world. Just as important were the business benefits: Using FlexNoC allowed us to create a small set of digital logic SoC dies that serve as the brains of more than one hundred different products, each customized for its particular market.
Oyvind Birkenes, General Manager, Wireless Connectivity Solutions, Texas Instruments
Texas Instruments
FlexNoC’s flexibility and automation, combined with our implementation of software-programmable on-chip firewalls and power disconnect features, enabled us to produce an entire product line with a minimal number of digital logic components.
Oyvind Birkenes, General Manager, Wireless Connectivity Solutions, Texas Instruments
Yogitech
The fruits of this YOGITECH and Arteris partnership will help the automotive and semiconductor industries to more quickly implement in silicon the complex features required for autonomous driving systems
Silvano Motto, President and CEO, Yogitech
Yogitech
Implementing functional safety features in silicon offers many advantages over software-only approaches by enabling less complexity, pre-characterized quality and more semiconductor vendor control over the system-wide functional safety feature implementations.
Silvano Motto, President and CEO, Yogitech