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Kurt Shuler

Kurt Shuler

Recent Posts by Kurt Shuler:

Semiconductor Engineering: Firmware Skills Shortage

Benoit de Lescure, CTO at Arteris IP is quoted in this new Semiconductor Engineering article:

Firmware Skills Shortage

February 25th, 2021 - By Brian Bailey

Adding intelligence into devices requires a different skill set, and finding enough qualified people is becoming a challenge — especially in less glamorous areas.

“I was working in the image compression domain 20 years ago,” says Benoit de Lescure, CTO for Arteris IP. “We had a similar issue, both with off-the-shelf DSP, and our own specialized DSP. Finding people to make efficient use of the SIMD hardware was extremely difficult, because you need to ‘think parallel’. But few people are ready to deep-dive into a hardware architecture that might be obsolete two or three years from now.”

Topics: SoC NoC network-on-chip semiconductor engineering arteris ip Benoit de Lescure DSP SIMD

EE Times article, "Licensing Interconnect IP for Fun & Profit"

Kurt Shuler, VP Marketing at Arteris IP, authored this EE Times article discussing NoC interconnect Build or Buy.

February 25, 2021 - by Kurt Shuler

Why do we buy instead of build? Because the guys at the factory know what they’re doing.

The big question then becomes, which parts do we design in-house, and which do we bring in from outside? That’s a whiteboard architectural discussion, which can be heated and emotional. Engineers want to build stuff — that’s what they do. Managers want to get a working product out the door as economically as possible — that’s what they do. If the engineers want to make, and the managers want to buy, who wins? Who gets to make that call, and how do they justify the decision? 

Topics: SoC economics semiconductor eetimes AI SoCs RTL kurt shuler noc interconnect ML/AI SoC IP R&D costs buy vs build build vs buy

SemiWiki: Arteris IP Folds in Magillem

Bernard Murphy (SemiWiki) gets an update from Kurt Shuler, vice president of Marketing at Arteris IP on the motivation behind the Arteris IP/Magillem merger.

Arteris IP Folds in Magillem. Perfect for SoC Integrators

February 18, 2021 - Bernard Murphy

Arteris IP and Magillem recently tied the knot, creating a merger of Network-on-Chip (NoC) and related Intellectual Property (IP) with a platform known for IP-XACT based SoC integration and related support. This is interesting to me because I’m familiar with products and people in both companies. I talked to Kurt Shuler, vice president of marketing to understand the rationale behind the acquisition.
Topics: SoC NoC network-on-chip semiconductor FlexNoC semiwiki ip-xact kurt shuler QoS noc interconnect Magillem Deployment Division

Arteris® IP Adds a Record 28 New Licensees in 2020

Network-on-Chip (NoC) semiconductor IP growth driven by customer development of new automotive, machine learning, 5G & data center system-on-chip (SoCs).

CAMPBELL, Calif. – February 17, 2021 – Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology that manages the on-chip communications in system-on-chip (SoC) semiconductor devices, today announced that the company added 28 new licensees for its Arteris® IP Ncore®, FlexNoC®, CodaCache®, AI Package, Resilience Package, and PIANO® Interconnect IP products in 2020. With the addition of these 28 new licensees, the cumulative number of Arteris IP semiconductor IP licensees throughout the company’s history reached 159. SoC design starts throughout the company’s history exceeded 500 chip projects. Furthermore, two large semiconductor vendor customers signed multi-year licensing deals with the company.

Despite the COVID headwinds, Arteris IP had a strong year based on both technology delivery and customer acquisition gains. Our focus on automotive, machine learning, 5G and data center applications has provided increased competitive value to our customers, who rewarded Arteris IP with an unprecedented number of SoC design wins.”


K. Charles Janac, President and CEOArteris IP

Topics: SoC NoC on-chip interconnect automotive AI K. Charles Janac ip-xact ML 5G IP market Isabelle Geday IP Deployment Division Board of Directors IPDD data center systems-on-chip GUI Tcl

Semiconductor Engineering: An Acquisition To Streamline SoC Integration

Kurt Shuler, VP of Marketing at Arteris IP authored this new article in Semiconductor Engineering:

An Acquisition To Streamline SoC Integration

February 16th, 2021 - By Kurt Shuler

Bringing order to the potential chaos of trying to combine IP from multiple suppliers.


Late last year Arteris IP closed its acquisition of Magillem assets, bringing together two companies with a single mission: To support integration of systems-on-chip (SoCs) at the interconnect fabric level and the data integration level. The value of joining forces has been appealing for some time. Since the early days of both companies, we’ve been working with mutual customers and integration teams within those customers. It’s not surprising that needs and goals look similar across all of those teams: High performance, low power and low impact communication across the SoC, efficiently integrating IPs from multiple suppliers, each configured correctly to that communication backbone. And all in as little schedule time as possible. Combining forces just made sense.

Topics: SoC NoC network-on-chip semiconductor engineering arteris ip ip-xact kurt shuler Magillem Design Services IP Deployment Division IPDD SoC integration quality of service

Arteris® IP Adds Two Veteran Executives to its Board of Directors

Network-on-Chip (NoC) semiconductor IP leader adds Raman Chitkara and Isabelle Geday to its Board of Directors 

CAMPBELL, Calif. – February 10, 2021 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Raman Chitkara and Isabelle Geday have joined its Board of Directors.

I am excited to be working with board members of Raman's and Isabelle's caliber and talent. With Raman's knowledge of accounting best practices and Isabelle's strong European and software management experience, we have a skilled and knowledgeable team of board members who will help navigate the evolution of Arteris IP.”


K. Charles Janac, President and CEOArteris IP

Topics: SoC NoC on-chip interconnect AI K. Charles Janac ML IP market Isabelle Geday IP Deployment Division Raman Chitkara Board of Directors

Semiconductor Engineering: Bridging The Gap Between Smart Cities And Autonomous Vehicles

Kurt Shuler, VP of Marketing at Arteris IP is quoted in this Semiconductor Engineering blog:

Bridging The Gap Between Smart Cities And Autonomous Vehicles

February 4th, 2021 - By Ann Steffora Mutschler

Communication, security, and power issues still need to be solved, but there is progress.


“It’s important to remember that a lot of power consumption is from the electric motor, so being able to optimize traffic and traffic flows will make a difference,” said Kurt Shuler, vice president of marketing at Arteris IP. “In terms of vehicle infrastructure, having the big Waze brain be able to actually direct your car and optimize all of that would reduce power. It’s like fleet management for FedEx, but for everybody.”

Topics: SoC NoC software network-on-chip automotive autonomous vehicles semiconductor engineering arteris ip kurt shuler v2x 5G smart cities

Arteris® IP FlexNoC® Interconnect and Resilience Package Supports Socionext's 5nm Automotive Chip Production

Automotive chip design leader standardizes on Network-on-Chip (NoC) interconnect IP for multiple ISO 26262-compliant systems-on-chip (SoCs)

CAMPBELL, Calif. and YOKOHAMA, Japan– February 4, 2021 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Socionext has implemented Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package in multiple automotive chips, including an automotive SoC fabricated using 5nm semiconductor process technology.

We are able to more efficiently design large scale automotive chips because we are able to see early in the design process the layout impacts of our SoC and NoC architecture choices. This is especially important when using leading edge 5nm semiconductor process technologies. Furthermore, our SoC functional safety architecture has been enhanced by the novel technologies in the FlexNoC interconnect IP Resilience Package, allowing us to quickly tailor safety mechanisms for the desired ISO 26262 ASIL to meet our customers’ demanding schedules."


Kaichi Yamashita, Head of the Automotive Business Unit, Socionext

Topics: SoC NoC functional safety network-on-chip on-chip interconnect flexnoc resilience package ADAS iso 26262 ASIL K. Charles Janac customer automotive chips IP market Socionext 5nm

Arteris® IP FlexNoC® Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip

Leading AI chipmaker Hailo uses world-leading network-on-chip (NoC) IP to accelerate dataflow performance

CAMPBELL, Calif. – January 12, 2021 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Hailo has licensed FlexNoC Interconnect IP and the accompanying Resilience Package for use in Hailo’s AI processor targeting automotive, smart cities, smart retail, Industry 4.0 and other markets.

The Arteris IP FlexNoc interconnect is much more efficient than competitive technologies. The state-of-the-art interconnect IP reduces the die area and power consumption of our unique architecture, which helps us to meet the market requirements."


Orr Danon, CEO, Hailo

Topics: SoC NoC network-on-chip on-chip interconnect flexnoc resilience package K. Charles Janac kurt shuler customer IP market hailo ai processor smart cities

Arteris® IP FlexNoc® Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet TSN Switch Chip

Japanese fabless semiconductor pioneer leverages Network-on-Chip (NoC) interconnect IP for on-chip quality-of-service (QoS) and ISO 26262 compliance.

CAMPBELL, Calif. – January 5, 2021 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that MegaChips has licensed Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package for use as the on-chip communications backbone for an automotive Ethernet TSN switch chip. MegaChips is a long-time Arteris IP licensee and are expert users of the company’s FlexNoC and Resilience Package interconnect IP products.

We adopted Arteris interconnect IP to accelerate development of our Automotive Ethernet TSN Switch Chip. Arteris IP FlexNoC effortlessly integrates functional safety mechanisms in our chip while allowing us to quickly analyze performance and quality-of-service using built-in simulation and an easy-to-use human interface. MegaChips has used Arteris NoC technology many times over the years and time we achieved amazing results such as small die area, low power consumption, easy development flow, and fast integrated performance analysis. Using Arteris NoC technology saves development resources and will speed up our entry into the automotive market. In addition, Arteris support is always quick and polite. They are the reason why we choose Arteris IP."


Hisashi Kondo, Senior General Manager, MegaChips

Topics: SoC NoC network-on-chip on-chip interconnect flexnoc resilience package kurt shuler charlie janac customer IP market megachips automotive fabless semiconductor Japanese automotive chip