Arteris Closes Acquisition of Cycuity
Arteris closes acquisition of Cycuity, adding leading semiconductor cybersecurity assurance technology to product portfolio.
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Arteris to Expand Portfolio with Acquisition of Cycuity, a Leader in Semiconductor Cybersecurity Assurance
Arteris has entered into a definitive agreement to acquire Cycuity, Inc., a leading provider of semiconductor cybersecurity assurance. This pending acquisition will enable Arteris' customers to achieve secure on-chip data movement. Learn more in the press release.
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Arteris Selected by Black Sesame Technologies for Next Generation of Intelligent Driving Silicon
Arteris’ Ncore 3 and FlexNoC 5 network-on-chip interconnect IPs enable data movement with data coherency, enhancing overall performance, efficiency, and time to market for advanced automotive SoCs.
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Blaize Deploys Arteris NoC IP to Power Scalable, Energy-Efficient Edge AI Solutions
CAMPBELL, Calif. – November 11, 2025 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP for accelerating semiconductor creation in the AI era, today announced that Blaize has adopted FlexNoC 5 interconnect IP to enhance the performance and
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EDN: AI workloads demand smarter SoC interconnect design
This EDN article explains how AI workloads are pushing traditional SoC interconnect design beyond practical limits, making intelligent automation essential. Physically aware NoC algorithms optimize topology, power, latency, and timing closure, enabling scalable AI SoCs from data centers to the
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2026 Predictions: System-Level Design, AI-Native Workflows, and the Rise of Multi-Die Compute Fabrics
Explore 2026 semiconductor predictions as AI accelerates system-level design, multi-die compute fabrics, chiplets, 2.5D/3D integration, and AI-native architecture workflows reshape how advanced systems are built and verified.
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Advancing Europe’s Automotive Chiplet Vision: Arteris Joins CHASSIS to Accelerate Software-Defined Mobility
Arteris joins CHASSIS, Europe’s open automotive chiplet initiative with advanced NoC and multi-die interconnect technology that accelerates software-defined mobility.
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Semiconductor Engineering: A Golden Source As The Single Source Of Truth In HSI
Maintaining alignment between hardware and software is one of the biggest challenges in complex SoC design. A single, machine-readable golden source keeps every element from RTL to drivers and documentation perfectly synchronized. Learn how Arteris’ Magillem Platform makes this possible
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Power Electronics Magazine: How Network-on-Chip Architectures Are Powering the Future of Microcontroller Design
Network-on-Chip (NoC) technology is redefining how microcontrollers (MCUs) handle performance, power efficiency, and scalability. As MCUs take on more complex, AI-driven, and safety-critical tasks, NoC architectures provide the structured, high-speed interconnects needed to keep pace. Learn more about how Arteris
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Semiconductor Engineering: Efficiency Defines The Future Of Data Movement
As AI workloads expand and chiplet architectures evolve, data movement now consumes more energy than computation itself. Achieving higher performance within fixed power budgets demands efficient, intelligent interconnects and automation across multi-die SoC designs. Learn more in the article.
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Cadence: Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
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Cadence: Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
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