Arteris Press Releases

Arteris® IP FlexNoC® Interconnect & Resilience Package Licensed by SiEngine for ISO 26262-Compliant Automotive Systems

State-of-the-art Network-on-Chip (NoC) interconnect increases chip performance, reduces design schedules, and provides functional safety mechanisms

CAMPBELL, Calif. – February 4, 2020 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that SiEngine has licensed the Arteris IP FlexNoC interconnect and the accompanying FlexNoC Resilience Package for use as the on-chip dataflow backbone of its next-generation automotive systems-on-chip (SoC).

We chose Arteris FlexNoC IP and the Resilience Package because of its integrated functional safety mechanisms and its ability to reduce on-chip routing congestion and increase performance. We are pleasantly surprised by the product’s rich functionality, flexible configuration and the excellent support from Arteris IP’s engineers, which allow us to achieve the specifically required functions with competitive performance.”

Xin-xin Yang, R&D Vice President, SiEngine

Topics: SoC NoC new customer automotive ISO 26262 resilience package performance AI chips ML/AI