Arteris Press Releases

Arteris® IP FlexNoC® Interconnect Again Licensed by AutoChips for Automotive SoC Product Line

Automotive semiconductor innovator standardizes on Arteris IP FlexNoC interconnect for use in its next-generation systems-on-chip.

CAMPBELL, Calif. – June 29, 2021 – Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology that manages the on-chip communications in system-on-chip (SoC) semiconductor devices, today announced that Chinese automotive semiconductor vendor AutoChips has again licensed FlexNoC interconnect IP for use in automotive systems-on-chip (SoCs).

Arteris FlexNoC IP has been critical to our ability to quickly design and qualify our chips for the automotive market. Arteris IP has unparalleled technology that meets the unique functional safety, performance and time to market needs of our rapidly evolving automotive semiconductor market. In addition to offering unique on-chip interconnect IP with a strong track record of mass production automotive designs, the local Arteris IP engineering support team's expertise in semiconductor architecture and design has provided added benefits to our company."


Cliff Gu, Chief DesignerAutoChips

Topics: automotive semiconductors china automotive SOCs semiconductor architecture

Arteris® IP FlexNoC® Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips

Network-on-chip interconnect technology with integrated functional safety mechanisms accelerates development of automotive systems-on-chip. 

CAMPBELL, Calif. – June 8, 2021– Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology, that manages the on-chip communications in system-on-chip (SoC) semiconductor devices, today announced that Black Sesame Technologies has licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its ISO 26262-compliant automotive advanced driver assistance systems (ADAS) chips. 

We successfully used the Arteris FlexNoC interconnect IP and Resilience Package in our previous generation ISO 26262 ASIL B systems and have been impressed with Arteris IP's product maturity, performance and functional safety capabilities. The Arteris IP FlexNoC interconnect and Resilience Package truly helped us more quickly develop our complex ADAS SoCs, which incorporate extensive artificial intelligence hardware acceleration, while providing the required functional safety mechanisms for us to achieve ISO 26262 compliance. In addition, the local Arteris IP engineering support team provided valuable architectural and functional safety feedback as we developed our chips.”


David Zeng, Senior VP, Black Sesame

Topics: automotive semiconductors Arteris FlexNoC flexnoc resilience package ADAS ISO 26262 compliance artificial intelligence ADAS SoC