Arteris joins CEVAnet partner program; CEVA licenses Arteris’ FlexNoC Interconnect IP
SUNNYVALE, California – March 1, 2011 – Arteris Inc., the leading supplier of network-on-chip (NoC) interconnect IP solutions and CEVA, Inc., [(Nasdaq: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Arteris has joined the CEVAnet partner program, bringing multi-core interconnect expertise to the comprehensive third-party technology offerings for CEVA DSP cores. In addition, CEVA has licensed Arteris’ advanced FlexNoC interconnect IP for optimizing CEVA’s future multi-core platforms.
“Arteris FlexNoC interconnect IP enables higher bandwidth and lower power consumption in multi-core architecture platforms.
We are pleased to welcome Arteris into our CEVAnet partner program and look forward to helping mutual customers targeting multi-core SoC designs.”
Eran Briman, Vice President of Marketing, CEVA, Inc.
For many years, CEVA’s industry-leading DSPs have been widely deployed in both homogenous and heterogeneous multi-core SoC architectures for a range of end markets. Next-generation designs call for even greater levels of performance at the lowest power consumption achievable, significantly increasing the challenges for the interconnect architecture and its scalability. To address these challenges, the companies have collaborated to bring Arteris’ advanced FlexNoC interconnect IP together with CEVA’s industry-leading DSP cores in a highly-optimized, high performance multi-core solution.
“Arteris FlexNoC interconnect IP enables higher bandwidth and lower power consumption in multi-core architecture platforms,” said Eran Briman, vice president of marketing at CEVA. “We are pleased to welcome Arteris into our CEVAnet partner program and look forward to helping mutual customers targeting multi-core SoC designs.”
“We are pleased to partner with CEVA and expand the reach of our FlexNoC interconnect IP to address CEVA’s extensive customer base developing multi-core SoCs,” said Charlie Janac, President and CEO of Arteris. “We believe the performance benefits that can be achieved through our partnership will enhance CEVA’s industry-leading products targeted for use in multi-core platforms. This opens a new market segment for Arteris FlexNoC technology as the interconnect of choice for IP providers.”
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs.
Founded by networking experts and offering the first commercially available Network-on-Chip IP products, Arteris operates globally with headquarters in Sunnyvale, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech. More information can be found at www.arteris.com.
About CEVA, Inc.
CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA's IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
Arteris, FlexNoC and the Arteris logo are trademarks of Arteris. All other product or service names are the property of their respective owners.
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