Network-on-Chip technology shortens design times and increases productivity
SUNNYVALE, California — May 30, 2013 — Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that HiSilicon Microelectronics, Inc. (Nasdaq:HiSilicon) has selected Arteris® FlexNoC® interconnect IP as the backbone SoC interconnect for its new wireless systems-on-chip (SoC) platforms.
HiSilicon’s use of Arteris FlexNoC fabric IP throughout their SoC product lines will continue to help reduce time-to-market and product costs.
Charlie Janac, President and CEO, Arteris
According to HiSilicon engineers and managers, using Arteris FlexNoC has enabled HiSilicon design teams to shorten design cycle times and increase team productivity. Team members were able to quickly and easily explore candidate SoC architectures using FlexNoC’s graphical user interface and automated design and verification flow. The smaller size and faster speed of the FlexNoC IP helped eliminate routing congestion and eased timing closure, also contributing to the fast design turnaround times.
“Arteris is honored to that HiSilicon has been so successful and satisfied using Arteris FlexNoC as the backbone of their SoCs,” said K. Charles Janac, President and CEO of Arteris. “HiSilicon’s use of Arteris FlexNoC fabric IP throughout their SoC product lines will continue to help reduce time-to-market and product costs.”
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs.
Founded by networking experts and offering the first commercially available Network-on-Chip IP products, Arteris operates globally with headquarters in Sunnyvale, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech. More information can be found at www.arteris.com.
HiSilicon Technologies Co., Ltd. is a leading chipset solution provider for telecom network, wireless terminal and digital media. HiSilicon has the advantage to provide end-to-end chipsets and solutions from telecom network to consumer electronics. It has been serving more than 200 global operators in over 100 countries and will continue to bring maximum value to global operators and consumers. For more information, please visit www.hisilicon.com.
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