Arteris Press Releases

Our use of the uniquely flexible Ncore cache coherent interconnect IP helped us to more quickly design and implement our next generation automotive ADAS chips while allowing us to increase hardware diagnostic coverage for ISO 26262 compliance. The Arteris IP team was very helpful in guiding us on the interconnect configuration to optimize system performance and hardware diagnostic coverage using the integrated functional safety mechanisms. Working with the highly professional Arteris team and their world class interconnect IP has helped us meet our performance requirements and schedule, while adding valuable capabilities that would not be possible with other interconnects.

Nobuaki Otsuka, Technology Executive at Electronic Device & Storage Corporation, Toshiba

Our new generation of autonomous driving systems require data protection within the on-chip NoC interconnect to meet ISO 26262 ASIL B functional safety requirements as well as extensive quality of service guarantees to meet the demanding needs of our AI hardware acceleration architecture. Arteris IP is the world leader in NoC interconnect technology and a pioneer in automotive and AI markets, and Arteris FlexNoC IP and the Resilience Package are helping us to more quickly develop our ISO 26262-compliant systems.”

David Zeng, VP of Engineering, Black Sesame

Arteris IP offers us technology and expertise in both network-on-chip interconnects and functional safety. The combination of FlexNoC and the Resilience Package enables us to develop chips that not only meet our demanding requirements for performance, power consumption and die area, but also incorporate on-chip functional safety mechanisms that help us achieve ISO 26262 certification for automotive functional safety.”

Maggie Qiu, CEO, Semidrive

Using Arteris FlexNoC IP as the on-chip interconnect for our reference designs allows us to quickly customize each platform for our customers’ performance, power, and ISO 26262 functional safety goals, while also providing a simple path to create follow-on derivative designs.

Dr.-Ing. Jens Benndorf, Managing Director and COO, Dream Chip Technologies