Arteris Press Releases

Configurability and Performance of FlexNoC is Key to Design of High-Performance Compute IP Platform for ADAS Applications

READING, UK and CAMPBELL, Calif. – May 3, 2022 -- Sondrel and Arteris IP (Nasdaq: AIP), a leading provider of system IP consisting of network-on-chip (NoC) interconnect and IP deployment software that accelerate system-on-chip (SoC) creation, today announced that Sondrel is adopting FlexNoC interconnect IP in its next generation of advanced driver-assistance systems (ADAS) architecture. The onchip-interconnect was selected for its configurability and performance. The product enables the SFA 350A multi-channel automotive vehicle IP platform requirements. FlexNoC supports the ability to design the NoC to match the performance of IP blocks to ensure that data flows at the right speed in, out and around the SoC. It enables designers to quickly design and verify a chip that precisely meets the customer’s silicon specifications on time and within budget.

Through many years of working with Arteris, we knew that FlexNoc would reliably deliver exactly what we needed, backed up by excellent technical support. The SoC interconnect provides a complete, comprehensive solution spanning architecture exploration to physical implementation and verification."

Edwin Loverseed, Head of Engineering, Sondrel

 

Network-on-chip interconnect technology with integrated functional safety mechanisms accelerates development of automotive systems-on-chip. 

CAMPBELL, Calif. – June 8, 2021– Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology, that manages the on-chip communications in system-on-chip (SoC) semiconductor devices, today announced that Black Sesame Technologies has licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its ISO 26262-compliant automotive advanced driver assistance systems (ADAS) chips. 

We successfully used the Arteris FlexNoC interconnect IP and Resilience Package in our previous generation ISO 26262 ASIL B systems and have been impressed with Arteris IP's product maturity, performance and functional safety capabilities. The Arteris IP FlexNoC interconnect and Resilience Package truly helped us more quickly develop our complex ADAS SoCs, which incorporate extensive artificial intelligence hardware acceleration, while providing the required functional safety mechanisms for us to achieve ISO 26262 compliance. In addition, the local Arteris IP engineering support team provided valuable architectural and functional safety feedback as we developed our chips.”

David Zeng, Senior VP, Black Sesame

Automotive chip design leader standardizes on Network-on-Chip (NoC) interconnect IP for multiple ISO 26262-compliant systems-on-chip (SoCs)

CAMPBELL, Calif. and YOKOHAMA, Japan– February 4, 2021 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Socionext has implemented Arteris^® FlexNoC^® interconnect IP and the accompanying Resilience Package in multiple automotive chips, including an automotive SoC fabricated using 5nm semiconductor process technology.

We are able to more efficiently design large scale automotive chips because we are able to see early in the design process the layout impacts of our SoC and NoC architecture choices. This is especially important when using leading edge 5nm semiconductor process technologies. Furthermore, our SoC functional safety architecture has been enhanced by the novel technologies in the FlexNoC interconnect IP Resilience Package, allowing us to quickly tailor safety mechanisms for the desired ISO 26262 ASIL to meet our customers’ demanding schedules."

Kaichi Yamashita, Head of the Automotive Business Unit, Socionext

CAMPBELL, Calif. – September 22, 2020 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that SemiDrive’s new ISO 26262-compliant smart e-cockpit, central gateway, autonomous driving and ADAS chips are powered by Arteris^® FlexNoC^® interconnect IP and the accompanying Resilience Package as the on-chip communications backbone.

We were very successful using Arteris IP NoC technology to optimize our chip’s bandwidth, latency and power consumption to meet the real time requirements of autonomous driving. Furthermore, the Arteris IP team was professional and diligent in helping us through the functional safety IP validation process which facilitated our ISO 26262 compliance process.”

Maggie Qui CEO, SemiDrive