Arteris Press Releases

Arteris® IP FlexNoC® Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips

Network-on-chip interconnect technology with integrated functional safety mechanisms accelerates development of automotive systems-on-chip. 

CAMPBELL, Calif. – June 8, 2021– Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology, that manages the on-chip communications in system-on-chip (SoC) semiconductor devices, today announced that Black Sesame Technologies has licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its ISO 26262-compliant automotive advanced driver assistance systems (ADAS) chips. 

We successfully used the Arteris FlexNoC interconnect IP and Resilience Package in our previous generation ISO 26262 ASIL B systems and have been impressed with Arteris IP's product maturity, performance and functional safety capabilities. The Arteris IP FlexNoC interconnect and Resilience Package truly helped us more quickly develop our complex ADAS SoCs, which incorporate extensive artificial intelligence hardware acceleration, while providing the required functional safety mechanisms for us to achieve ISO 26262 compliance. In addition, the local Arteris IP engineering support team provided valuable architectural and functional safety feedback as we developed our chips.”


David Zeng, Senior VP, Black Sesame

Topics: automotive semiconductors Arteris FlexNoC flexnoc resilience package ADAS ISO 26262 compliance artificial intelligence ADAS SoC

Arteris® IP FlexNoC® Interconnect and Resilience Package Supports Socionext's 5nm Automotive Chip Production

Automotive chip design leader standardizes on Network-on-Chip (NoC) interconnect IP for multiple ISO 26262-compliant systems-on-chip (SoCs)

CAMPBELL, Calif. and YOKOHAMA, Japan– February 4, 2021 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Socionext has implemented Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package in multiple automotive chips, including an automotive SoC fabricated using 5nm semiconductor process technology.

We are able to more efficiently design large scale automotive chips because we are able to see early in the design process the layout impacts of our SoC and NoC architecture choices. This is especially important when using leading edge 5nm semiconductor process technologies. Furthermore, our SoC functional safety architecture has been enhanced by the novel technologies in the FlexNoC interconnect IP Resilience Package, allowing us to quickly tailor safety mechanisms for the desired ISO 26262 ASIL to meet our customers’ demanding schedules."


Kaichi Yamashita, Head of the Automotive Business Unit, Socionext

Topics: SoC NoC functional safety network-on-chip on-chip interconnect flexnoc resilience package ADAS iso 26262 ASIL K. Charles Janac customer automotive chips IP market Socionext 5nm

Arteris IP FlexNoC® & Resilience Package Support SemiDrive ISO 26262-Compliant Chip Production

CAMPBELL, Calif. – September 22, 2020 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that SemiDrive’s new ISO 26262-compliant smart e-cockpit, central gateway, autonomous driving and ADAS chips are powered by Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package as the on-chip communications backbone.

We were very successful using Arteris IP NoC technology to optimize our chip’s bandwidth, latency and power consumption to meet the real time requirements of autonomous driving. Furthermore, the Arteris IP team was professional and diligent in helping us through the functional safety IP validation process which facilitated our ISO 26262 compliance process.”


Maggie Qui CEO, SemiDrive

Topics: functional safety ISO 26262 Arteris FlexNoC new customer flexnoc resilience package ADAS autonomous driving SoCs SoC chips on-chip communications dataflow e-cockpit

Silicon-Proven Arteris IP Ncore ® Cache Coherent Interconnect Implemented in Toshiba ISO 26262-Compliant ADAS Chip

Toshiba tapes out next-generation automotive ADAS system-on-chip (SoC) using mature network-on-chip interconnect technology

CAMPBELL, Calif. — June. 11, 2019 — Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect semiconductor intellectual property, today announced that Toshiba has taped out its next generation automotive advanced driver assistance system (ADAS) chip using the Arteris IP Ncore Cache Coherent and FlexNoC®non-coherent interconnect with the associated Resilience Package.

Our use of the uniquely flexible Ncore cache coherent interconnect IP helped us to more quickly design and implement our next generation automotive ADAS chips while allowing us to increase hardware diagnostic coverage for ISO 26262 compliance. The Arteris IP team was very helpful in guiding us on the interconnect configuration to optimize system performance and hardware diagnostic coverage using the integrated functional safety mechanisms. Working with the highly professional Arteris team and their world class interconnect IP has helped us meet our performance requirements and schedule, while adding valuable capabilities that would not be possible with other interconnects.


Nobuaki Otsuka, Technology Executive at Electronic Device & Storage Corporation, Toshiba

Topics: SoC ISO 26262 automotive semiconductors japan flexnoc resilience package ADAS cache coherent interconnect advanced driver assistance systems adas imaging processor ncore cache coherent interconnect