Arteris Press Releases

Arteris® IP FlexNoC® Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip

Leading AI chipmaker Hailo uses world-leading network-on-chip (NoC) IP to accelerate dataflow performance

CAMPBELL, Calif. – January 12, 2021 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Hailo has licensed FlexNoC Interconnect IP and the accompanying Resilience Package for use in Hailo’s AI processor targeting automotive, smart cities, smart retail, Industry 4.0 and other markets.

The Arteris IP FlexNoC interconnect is much more efficient than competitive technologies. The state-of-the-art interconnect IP reduces the die area and power consumption of our unique architecture, which helps us to meet the market requirements."

Orr Danon, CEO, Hailo

Topics: SoC NoC network-on-chip on-chip interconnect flexnoc resilience package K. Charles Janac kurt shuler customer IP market hailo ai processor smart cities