Arteris Press Releases

Sondrel Deploys Arteris IP for Next-Generation Multi-Channel Automotive SoC

Configurability and Performance of FlexNoC is Key to Design of High-Performance Compute IP Platform for ADAS Applications

READING, UK and CAMPBELL, Calif. – May 3, 2022 -- Sondrel and Arteris IP (Nasdaq: AIP), a leading provider of system IP consisting of network-on-chip (NoC) interconnect and IP deployment software that accelerate system-on-chip (SoC) creation, today announced that Sondrel is adopting FlexNoC interconnect IP in its next generation of advanced driver-assistance systems (ADAS) architecture. The onchip-interconnect was selected for its configurability and performance. The product enables the SFA 350A multi-channel automotive vehicle IP platform requirements. FlexNoC supports the ability to design the NoC to match the performance of IP blocks to ensure that data flows at the right speed in, out and around the SoC. It enables designers to quickly design and verify a chip that precisely meets the customer’s silicon specifications on time and within budget.

 

Through many years of working with Arteris, we knew that FlexNoc would reliably deliver exactly what we needed, backed up by excellent technical support. The SoC interconnect provides a complete, comprehensive solution spanning architecture exploration to physical implementation and verification."


Edwin Loverseed, Head of Engineering, Sondrel

 

Topics: IP System-on-Chip NoC ISO 26262 Networks-On-Chip Arteris FlexNoC automotive ADAS radar soc architecture verification LIDAR SoCs high-performance sensors ASIC ip deployment Arteris IP (AIP) SFA 350A processor silicon chips compute solutions Edwin Loverseed

Arteris® IP FlexNoC® Interconnect and Resilience Package Licensed in Neural Network Accelerator Chip Project Led by BMW Group

NoC interconnect IP to be dataflow backbone of German Federal Ministry of Education and Research (BMBF) project chip to advance automotive artificial intelligence and machine learning (AI/ML) processing.

CAMPBELL, Calif. – April 5, 2022 – Arteris IP (NASDAQ: AIP), a leading provider of system-on-chip (SoC) system IP consisting of network-on-chip (NoC) interconnect and IP deployment software that accelerate SoC creation, today announced that BMW Group has licensed FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package IP for use in a chip partially funded by the German Federal Ministry of Education and Research (BMBF) as part of the ZUSE-KI-mobil publicly funded project. The goal of the project is to develop an accelerator chip for high-end deep learning applications that is a leap forward in terms of energy efficiency, reliability, robustness and security, which go far beyond current possibilities. BMW Group is serving as the coordinator and leader of the project.

We are excited that the consortium led by BMW Group chose Arteris IP interconnect technology as the on-chip communications on-chip network for this innovative automotive system-on-chip. BMW Group’s decision to use our interconnect IP as the dataflow on-chip network of this complex system is a testimony to the benefits our technologies bring to design teams creating the world’s most sophisticated AI/ML processing chips."


K. Charles Janac, President and CEO, Arteris IP

Topics: System-on-Chip functional safety Arteris FlexNoC automotive flexnoc resilience package reliability machine learning artificial intelligence neural network AI latency SoCs power efficiency noc interconnect on-chip communications dataflow Arteris IP FlexNoC interconnect AI/ML ip deployment mobile usage IP blocks system ip Arteris IP (AIP) BMW Group ZUSE-KI-mobil processing chips BMBF

Arteris® IP FlexNoC® Interconnect Licensed by Eyenix for AI-Enabled Imaging/Digital Camera SoC

NoC interconnect IP to be dataflow backbone for image signal processors providing enhanced sensitivity, high-resolution HD imaging through low current, low power in a single-chip solution for the security/surveillance market.

CAMPBELL, Calif. – October 19, 2021 – Arteris IP, a leading provider of system-on-chip (SoC) system IP consisting of network-on-chip (NoC) interconnect and IP deployment software that accelerate SoC creation, today announced that imaging SoC leader Eyenix has licensed FlexNoC interconnect IP for its next-generation image processing system-on-chip (SoC).

Eyenix’s mission is to bring a seamless high-resolution and high-performance imaging solution to super-enhanced HD video, surveillance, consumer and advanced imaging applications. Arteris NoC IP helped us to design complex AI functions and smoothly integrate all the advanced functions we created to deliver this state-of-the-art image signal processor system-on-chip. Arteris IP engineering support has been very responsive and helpful throughout our evaluation and development processes."


Dr. Jon Hwang, CEO, Eyenix

Topics: Arteris FlexNoC new customer AI SoCs noc interconnect high-bandwidth cameras consumer Eyenix mobile usage image processing IP blocks HD video

Arteris® IP Announces 4D LiDAR Pioneer Aeva as its 200th Customer

4D LiDAR innovator licenses Arteris IP FlexNoC Interconnect to enable pioneering system-on-chip (SoC) for digital data processing

CAMPBELL, Calif. – September 28, 2021 – Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology that manages the on-chip communications in digital system-on-chip (SoC) semiconductor devices, today announced that 4D LiDAR innovator Aeva Technologies, Inc., has licensed FlexNoC interconnect IP for its next-generation digital processing system-on-chip (SoC).

Aeva's mission is to bring the next wave of perception to all devices through our innovative and scalable 4D LiDAR on chip technology. Arteris NoC IP helps us to integrate complex functions on a single digital processing chip and Arteris IP engineering support has been quite proactive"


Syrus Ziai, Vice President of Silicon Engineering, Aeva

Topics: functional safety Arteris FlexNoC new customer LIDAR SoCs noc interconnect Aeva 200th customer low power consumption Time-to-flight 4D Lidar