Arteris Press Releases

Arteris® IP FlexNoC® Interconnect Licensed by Eyenix for AI-Enabled Imaging/Digital Camera SoC

NoC interconnect IP to be dataflow backbone for image signal processors providing enhanced sensitivity, high-resolution HD imaging through low current, low power in a single-chip solution for the security/surveillance market.

CAMPBELL, Calif. – October 19, 2021 – Arteris IP, a leading provider of system-on-chip (SoC) system IP consisting of network-on-chip (NoC) interconnect and IP deployment software that accelerate SoC creation, today announced that imaging SoC leader Eyenix has licensed FlexNoC interconnect IP for its next-generation image processing system-on-chip (SoC).

Eyenix’s mission is to bring a seamless high-resolution and high-performance imaging solution to super-enhanced HD video, surveillance, consumer and advanced imaging applications. Arteris NoC IP helped us to design complex AI functions and smoothly integrate all the advanced functions we created to deliver this state-of-the-art image signal processor system-on-chip. Arteris IP engineering support has been very responsive and helpful throughout our evaluation and development processes."


Dr. Jon Hwang, CEO, Eyenix

Topics: Arteris FlexNoC new customer AI SoCs noc interconnect high-bandwidth cameras consumer Eyenix mobile usage image processing IP blocks HD video

Arteris® IP Announces 4D LiDAR Pioneer Aeva as its 200th Customer

4D LiDAR innovator licenses Arteris IP FlexNoC Interconnect to enable pioneering system-on-chip (SoC) for digital data processing

CAMPBELL, Calif. – September 28, 2021 – Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology that manages the on-chip communications in digital system-on-chip (SoC) semiconductor devices, today announced that 4D LiDAR innovator Aeva Technologies, Inc., has licensed FlexNoC interconnect IP for its next-generation digital processing system-on-chip (SoC).

Aeva's mission is to bring the next wave of perception to all devices through our innovative and scalable 4D LiDAR on chip technology. Arteris NoC IP helps us to integrate complex functions on a single digital processing chip and Arteris IP engineering support has been quite proactive"


Syrus Ziai, Vice President of Silicon Engineering, Aeva

Topics: functional safety Arteris FlexNoC new customer LIDAR SoCs noc interconnect Aeva 200th customer low power consumption Time-to-flight 4D Lidar

Arteris® IP FlexNoC® Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips

Network-on-chip interconnect technology with integrated functional safety mechanisms accelerates development of automotive systems-on-chip. 

CAMPBELL, Calif. – June 8, 2021– Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology, that manages the on-chip communications in system-on-chip (SoC) semiconductor devices, today announced that Black Sesame Technologies has licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its ISO 26262-compliant automotive advanced driver assistance systems (ADAS) chips. 

We successfully used the Arteris FlexNoC interconnect IP and Resilience Package in our previous generation ISO 26262 ASIL B systems and have been impressed with Arteris IP's product maturity, performance and functional safety capabilities. The Arteris IP FlexNoC interconnect and Resilience Package truly helped us more quickly develop our complex ADAS SoCs, which incorporate extensive artificial intelligence hardware acceleration, while providing the required functional safety mechanisms for us to achieve ISO 26262 compliance. In addition, the local Arteris IP engineering support team provided valuable architectural and functional safety feedback as we developed our chips.”


David Zeng, Senior VP, Black Sesame

Topics: automotive semiconductors Arteris FlexNoC flexnoc resilience package ADAS ISO 26262 compliance artificial intelligence ADAS SoC

Arteris® IP FlexNoC® Interconnect Products Licensed by Bosch for Multiple Automotive Chips

World's #1 automotive supplier chooses Network-on-Chip interconnect leader for ISO 26262-compliant systems-on-chip (SoCs)

CAMPBELL, Calif. – November 3, 2020 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Bosch has licensed Arteris FlexNoC Interconnect IP and the accompanying Resilience Package for use in multiple ISO 26262-compliant automotive projects.

Arteris IP provides the easiest and fastest means to assemble the complex chips we require while allowing us to implement innovative functional safety mechanisms within our designs. We are excited to partner together not only because of Arteris IP’s excellent technology and solid roadmap, but also the experience and credibility of their engineering talent.”

 


Oliver Wolst, Senior Vice President Integrated Circuits, at Robert Bosch GmBH

Topics: SoC network-on-chip Arteris FlexNoC new customer automotive flexnoc resilience package automotive functional safety NoC technology autonomous driving ISO 26262 compliant automotive Tier-1 automotive supplier roadmap Bosch