Arteris Press Releases

Arteris® IP FlexNoC® Interconnect and Resilience Package Supports Socionext's 5nm Automotive Chip Production

Automotive chip design leader standardizes on Network-on-Chip (NoC) interconnect IP for multiple ISO 26262-compliant systems-on-chip (SoCs)

CAMPBELL, Calif. and YOKOHAMA, Japan– February 4, 2021 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Socionext has implemented Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package in multiple automotive chips, including an automotive SoC fabricated using 5nm semiconductor process technology.

We are able to more efficiently design large scale automotive chips because we are able to see early in the design process the layout impacts of our SoC and NoC architecture choices. This is especially important when using leading edge 5nm semiconductor process technologies. Furthermore, our SoC functional safety architecture has been enhanced by the novel technologies in the FlexNoC interconnect IP Resilience Package, allowing us to quickly tailor safety mechanisms for the desired ISO 26262 ASIL to meet our customers’ demanding schedules."

Kaichi Yamashita, Head of the Automotive Business Unit, Socionext

Topics: SoC NoC functional safety network-on-chip on-chip interconnect flexnoc resilience package ADAS iso 26262 ASIL K. Charles Janac customer automotive chips IP market Socionext 5nm