Arteris Press Releases

Arteris® IP FlexNoC® Interconnect Again Licensed by AutoChips for Automotive SoC Product Line

Automotive semiconductor innovator standardizes on Arteris IP FlexNoC interconnect for use in its next-generation systems-on-chip.

CAMPBELL, Calif. – June 29, 2021 – Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology that manages the on-chip communications in system-on-chip (SoC) semiconductor devices, today announced that Chinese automotive semiconductor vendor AutoChips has again licensed FlexNoC interconnect IP for use in automotive systems-on-chip (SoCs).

Arteris FlexNoC IP has been critical to our ability to quickly design and qualify our chips for the automotive market. Arteris IP has unparalleled technology that meets the unique functional safety, performance and time to market needs of our rapidly evolving automotive semiconductor market. In addition to offering unique on-chip interconnect IP with a strong track record of mass production automotive designs, the local Arteris IP engineering support team's expertise in semiconductor architecture and design has provided added benefits to our company."


Cliff Gu, Chief DesignerAutoChips

Topics: automotive semiconductors china automotive SOCs semiconductor architecture

Arteris® IP FlexNoC® Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips

Network-on-chip interconnect technology with integrated functional safety mechanisms accelerates development of automotive systems-on-chip. 

CAMPBELL, Calif. – June 8, 2021– Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology, that manages the on-chip communications in system-on-chip (SoC) semiconductor devices, today announced that Black Sesame Technologies has licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its ISO 26262-compliant automotive advanced driver assistance systems (ADAS) chips. 

We successfully used the Arteris FlexNoC interconnect IP and Resilience Package in our previous generation ISO 26262 ASIL B systems and have been impressed with Arteris IP's product maturity, performance and functional safety capabilities. The Arteris IP FlexNoC interconnect and Resilience Package truly helped us more quickly develop our complex ADAS SoCs, which incorporate extensive artificial intelligence hardware acceleration, while providing the required functional safety mechanisms for us to achieve ISO 26262 compliance. In addition, the local Arteris IP engineering support team provided valuable architectural and functional safety feedback as we developed our chips.”


David Zeng, Senior VP, Black Sesame

Topics: automotive semiconductors Arteris FlexNoC flexnoc resilience package ADAS ISO 26262 compliance artificial intelligence ADAS SoC

Silicon-Proven Arteris IP Ncore ® Cache Coherent Interconnect Implemented in Toshiba ISO 26262-Compliant ADAS Chip

Toshiba tapes out next-generation automotive ADAS system-on-chip (SoC) using mature network-on-chip interconnect technology

CAMPBELL, Calif. — June. 11, 2019 — Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect semiconductor intellectual property, today announced that Toshiba has taped out its next generation automotive advanced driver assistance system (ADAS) chip using the Arteris IP Ncore Cache Coherent and FlexNoC®non-coherent interconnect with the associated Resilience Package.

Our use of the uniquely flexible Ncore cache coherent interconnect IP helped us to more quickly design and implement our next generation automotive ADAS chips while allowing us to increase hardware diagnostic coverage for ISO 26262 compliance. The Arteris IP team was very helpful in guiding us on the interconnect configuration to optimize system performance and hardware diagnostic coverage using the integrated functional safety mechanisms. Working with the highly professional Arteris team and their world class interconnect IP has helped us meet our performance requirements and schedule, while adding valuable capabilities that would not be possible with other interconnects.


Nobuaki Otsuka, Technology Executive at Electronic Device & Storage Corporation, Toshiba

Topics: SoC ISO 26262 automotive semiconductors japan flexnoc resilience package ADAS cache coherent interconnect advanced driver assistance systems adas imaging processor ncore cache coherent interconnect

Arteris® IP FlexNoC® Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS

Mature network-on-chip interconnect technology enables smoother ASIL certification and time to market for AI-powered autonomous driving systems

CAMPBELL, Calif. May 14, 2019– Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Black Sesame Technologies has licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its next-generation automotive advanced driver assistance systems (ADAS) that utilize advanced artificial intelligence (AI) algorithms for autonomous driving capabilities.

Our new generation of autonomous driving systems require data protection within the on-chip NoC interconnect to meet ISO 26262 ASIL B functional safety requirements as well as extensive quality of service guarantees to meet the demanding needs of our AI hardware acceleration architecture. Arteris IP is the world leader in NoC interconnect technology and a pioneer in automotive and AI markets, and Arteris FlexNoC IP and the Resilience Package are helping us to more quickly develop our ISO 26262-compliant systems.”


David Zeng, VP of Engineering, Black Sesame

Topics: automotive semiconductors Arteris FlexNoC new customer flexnoc resilience package ADAS ISO 26262 compliance artificial intelligence