Arteris Press Releases

Arteris® IP FlexNoC® Interconnect and Resilience Package Licensed in Neural Network Accelerator Chip Project Led by BMW Group

NoC interconnect IP to be dataflow backbone of German Federal Ministry of Education and Research (BMBF) project chip to advance automotive artificial intelligence and machine learning (AI/ML) processing.

CAMPBELL, Calif. – April 5, 2022 – Arteris IP (NASDAQ: AIP), a leading provider of system-on-chip (SoC) system IP consisting of network-on-chip (NoC) interconnect and IP deployment software that accelerate SoC creation, today announced that BMW Group has licensed FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package IP for use in a chip partially funded by the German Federal Ministry of Education and Research (BMBF) as part of the ZUSE-KI-mobil publicly funded project. The goal of the project is to develop an accelerator chip for high-end deep learning applications that is a leap forward in terms of energy efficiency, reliability, robustness and security, which go far beyond current possibilities. BMW Group is serving as the coordinator and leader of the project.

We are excited that the consortium led by BMW Group chose Arteris IP interconnect technology as the on-chip communications on-chip network for this innovative automotive system-on-chip. BMW Group’s decision to use our interconnect IP as the dataflow on-chip network of this complex system is a testimony to the benefits our technologies bring to design teams creating the world’s most sophisticated AI/ML processing chips."


K. Charles Janac, President and CEO, Arteris IP

Topics: System-on-Chip functional safety Arteris FlexNoC automotive flexnoc resilience package reliability machine learning artificial intelligence neural network AI latency SoCs power efficiency noc interconnect on-chip communications dataflow Arteris IP FlexNoC interconnect AI/ML ip deployment mobile usage IP blocks system ip Arteris IP (AIP) BMW Group ZUSE-KI-mobil processing chips BMBF

Arteris IP FlexNoC® & Resilience Package Support SemiDrive ISO 26262-Compliant Chip Production

CAMPBELL, Calif. – September 22, 2020 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that SemiDrive’s new ISO 26262-compliant smart e-cockpit, central gateway, autonomous driving and ADAS chips are powered by Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package as the on-chip communications backbone.

We were very successful using Arteris IP NoC technology to optimize our chip’s bandwidth, latency and power consumption to meet the real time requirements of autonomous driving. Furthermore, the Arteris IP team was professional and diligent in helping us through the functional safety IP validation process which facilitated our ISO 26262 compliance process.”


Maggie Qui CEO, SemiDrive

Topics: functional safety ISO 26262 Arteris FlexNoC new customer flexnoc resilience package ADAS autonomous driving SoCs SoC chips on-chip communications dataflow e-cockpit

Arteris IP FlexNoC® Interconnect Licensed by VITEC for High Resolution Video Encoder and Decoder Chips

CAMPBELL, Calif. – September 15, 2020 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that VITEC has licensed Arteris FlexNoC Interconnect IP for use in its high resolution video encoder and decoder systems.

Arteris FlexNoC interconnect technology has enabled us to optimize the increased on-chip bandwidth of our next generation H.265 hardware while reducing the die area of our chips. Implementing FlexNoC IP as the on-chip dataflow backbone of our chips reduces our costs while increasing video encode and decode performance, which helps us maintain our competitive advantage.”


Richard Bernard, Senior Product Manager, VITEC

Topics: Arteris FlexNoC new customer SoC chips on-chip bandwidth dataflow IPTV satellite video systems backbone