Arteris Press Releases

Arteris® IP Announces 4D LiDAR Pioneer Aeva as its 200th Customer

4D LiDAR innovator licenses Arteris IP FlexNoC Interconnect to enable pioneering system-on-chip (SoC) for digital data processing

CAMPBELL, Calif. – September 28, 2021 – Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology that manages the on-chip communications in digital system-on-chip (SoC) semiconductor devices, today announced that 4D LiDAR innovator Aeva Technologies, Inc., has licensed FlexNoC interconnect IP for its next-generation digital processing system-on-chip (SoC).

Aeva's mission is to bring the next wave of perception to all devices through our innovative and scalable 4D LiDAR on chip technology. Arteris NoC IP helps us to integrate complex functions on a single digital processing chip and Arteris IP engineering support has been quite proactive"


Syrus Ziai, Vice President of Silicon Engineering, Aeva

Topics: functional safety Arteris FlexNoC new customer LIDAR SoCs noc interconnect Aeva 200th customer low power consumption Time-to-flight 4D Lidar

Arteris® IP FlexNoC® Interconnect and Resilience Package Supports Socionext's 5nm Automotive Chip Production

Automotive chip design leader standardizes on Network-on-Chip (NoC) interconnect IP for multiple ISO 26262-compliant systems-on-chip (SoCs)

CAMPBELL, Calif. and YOKOHAMA, Japan– February 4, 2021 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Socionext has implemented Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package in multiple automotive chips, including an automotive SoC fabricated using 5nm semiconductor process technology.

We are able to more efficiently design large scale automotive chips because we are able to see early in the design process the layout impacts of our SoC and NoC architecture choices. This is especially important when using leading edge 5nm semiconductor process technologies. Furthermore, our SoC functional safety architecture has been enhanced by the novel technologies in the FlexNoC interconnect IP Resilience Package, allowing us to quickly tailor safety mechanisms for the desired ISO 26262 ASIL to meet our customers’ demanding schedules."


Kaichi Yamashita, Head of the Automotive Business Unit, Socionext

Topics: SoC NoC functional safety network-on-chip on-chip interconnect flexnoc resilience package ADAS iso 26262 ASIL K. Charles Janac customer automotive chips IP market Socionext 5nm

Arteris IP FlexNoC® & Resilience Package Support SemiDrive ISO 26262-Compliant Chip Production

CAMPBELL, Calif. – September 22, 2020 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that SemiDrive’s new ISO 26262-compliant smart e-cockpit, central gateway, autonomous driving and ADAS chips are powered by Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package as the on-chip communications backbone.

We were very successful using Arteris IP NoC technology to optimize our chip’s bandwidth, latency and power consumption to meet the real time requirements of autonomous driving. Furthermore, the Arteris IP team was professional and diligent in helping us through the functional safety IP validation process which facilitated our ISO 26262 compliance process.”


Maggie Qui CEO, SemiDrive

Topics: functional safety ISO 26262 Arteris FlexNoC new customer flexnoc resilience package ADAS autonomous driving SoCs SoC chips on-chip communications dataflow e-cockpit

ArterisIP and ResilTech to Present at ISO 26262 Semiconductors Conference

Automotive IQ 1st Annual International Conference on the Application of ISO 26262 to Semiconductors (Dec. 5-7) to feature fault simulation lessons learned

CAMPBELL, Calif. and PONTEDERA, Italy — November 28, 2017 — ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, and ResilTech S.R.L., the leader in resilient computing and functional safety for automotive systems, will jointly present at Automotive IQ’s Application of ISO 26262 to Semiconductors conference on December 5th through the 7th, 2017, in Munich, Germany.

As automotive systems-on-chip increase in size and complexity, it has become increasingly important to perform safety analyses using executable models of IPs, and to define standard formats to exchange information between IP suppliers and SoC integrators.


Francesco Rossi, Automotive Safety Solution Manager, ResilTech

Topics: functional safety ISO 26262 ResilTech ISO 26262 compliance ISO 26262 specification