Arteris Press Releases

Network-on-Chip technology shortens design times and reduces chip costs

CAMPBELL, California — July 1, 2014 — Arteris Inc., the inventor and leading supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that HiSilicon Technologies Co., Ltd. has licensed Arteris® FlexNoC® interconnect IP for use as the on-chip interconnect fabric in multiple systems-on-chip (SoCs) targeting many market segments.

HiSilicon’s decision to use Arteris FlexNoC fabric IP for many projects proves that FlexNoC IP significantly reduces the economic costs and risks for companies designing SoCs.

K. Charles Janac, President and CEO, Arteris

Arteris NoC technology used by four of the top five Chinese fabless semiconductor OEMs

SUNNYVALE, California — August 19, 2013 — Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that its interconnect fabric IP has been licensed and deployed in a majority of chips developed by China’s leading semiconductor companies for applications including consumer electronics, smartphones, and tablets. Based on the IHS iSuppli ranking of the top Chinese fabless semiconductor OEMs in terms of revenue, Arteris counts four of the top five OEMs as customers - Spreadtrum Communications, HiSilicon Technologies, RDA Technologies and Allwinner Technology.

Arteris has provided exceptional support to our teams, giving us the confidence to implement the FlexNoC solution in our critical Smartphone SoC platform.

Li Shiqin, IC Design Manager, Rockchip

We have seen first-hand how the interconnect IP improves process flow and overall system performance.

Ding Ran, CTO, Allwinner Technology

Network-on-Chip technology shortens design times and increases productivity

SUNNYVALE, California — May 30, 2013 — Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that HiSilicon Microelectronics, Inc. (Nasdaq:HiSilicon) has selected Arteris® FlexNoC® interconnect IP as the backbone SoC interconnect for its new wireless systems-on-chip (SoC) platforms.

HiSilicon’s use of Arteris FlexNoC fabric IP throughout their SoC product lines will continue to help reduce time-to-market and product costs.

Charlie Janac, President and CEO, Arteris