Arteris Press Releases

Arteris® IP Added to Russell 2000® Index

CAMPBELL, Calif. – Jan. 6, 2022 (GLOBE NEWSWIRE) – Arteris IP (NASDAQ: AIP), a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology that manages the on-chip communications in digital system-on-chip (SoC) semiconductor devices, today announced that the company was added to the Russell 2000® Index effective after the U.S. market opened on December 20, 2021. Membership in the Russell 2000 Index, which remains in place until the next reconstitution, is based on membership in the broad-market Russell 3000® Index. The stock has been automatically added to the appropriate growth and value indexes.

Topics: NoC ISO 26262 arteris ip charlie janac Nasdaq AIP Russell 2000 FTSE Russell London Stock Exchange Group Arteris IP IPO

Arteris® IP Helps Automate System-on-Chip Semiconductor Design Traceability with Harmony Trace™️ Design Data

Enterprise-level server-based application increases system quality and enables faster Functional Safety Certifications by creating and maintaining traceability between different systems.

CAMPBELL, Calif. – November 16, 2021 – Arteris IP (NASDAQ: AIP), a leading provider of system-on-chip (SoC) system IP consisting of network-on-chip (NoC) interconnect and IP deployment software that accelerate SoC creation, today announced the launch of the Arteris® Harmony Trace™️ Design Data Intelligence Solution to ease compliance with semiconductor industry functional safety and quality standards such as ISO 26262, IEC 61508, ISO 9001, and IATF 16949.

Topics: NoC functional safety ISO 26262 arteris ip traceability Nasdaq AIP IP development software enterprise level data design intelligence solution Harmony Trace

Arteris IP FlexNoC® & Resilience Package Support SemiDrive ISO 26262-Compliant Chip Production

CAMPBELL, Calif. – September 22, 2020 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that SemiDrive’s new ISO 26262-compliant smart e-cockpit, central gateway, autonomous driving and ADAS chips are powered by Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package as the on-chip communications backbone.

We were very successful using Arteris IP NoC technology to optimize our chip’s bandwidth, latency and power consumption to meet the real time requirements of autonomous driving. Furthermore, the Arteris IP team was professional and diligent in helping us through the functional safety IP validation process which facilitated our ISO 26262 compliance process.”


Maggie Qui CEO, SemiDrive

Topics: functional safety ISO 26262 Arteris FlexNoC new customer flexnoc resilience package ADAS autonomous driving SoCs SoC chips on-chip communications dataflow e-cockpit

Silicon-Proven Arteris IP Ncore ® Cache Coherent Interconnect Implemented in Toshiba ISO 26262-Compliant ADAS Chip

Toshiba tapes out next-generation automotive ADAS system-on-chip (SoC) using mature network-on-chip interconnect technology

CAMPBELL, Calif. — June. 11, 2019 — Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect semiconductor intellectual property, today announced that Toshiba has taped out its next generation automotive advanced driver assistance system (ADAS) chip using the Arteris IP Ncore Cache Coherent and FlexNoC®non-coherent interconnect with the associated Resilience Package.

Our use of the uniquely flexible Ncore cache coherent interconnect IP helped us to more quickly design and implement our next generation automotive ADAS chips while allowing us to increase hardware diagnostic coverage for ISO 26262 compliance. The Arteris IP team was very helpful in guiding us on the interconnect configuration to optimize system performance and hardware diagnostic coverage using the integrated functional safety mechanisms. Working with the highly professional Arteris team and their world class interconnect IP has helped us meet our performance requirements and schedule, while adding valuable capabilities that would not be possible with other interconnects.


Nobuaki Otsuka, Technology Executive at Electronic Device & Storage Corporation, Toshiba

Topics: SoC ISO 26262 automotive semiconductors japan flexnoc resilience package ADAS cache coherent interconnect advanced driver assistance systems adas imaging processor ncore cache coherent interconnect