Arteris Press Releases

Complete interconnect IP solution accelerates image processing system-on-chip (SoC) development

CAMPBELL, Calif. — February 7, 2017 —  Arteris Inc., the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that Nextchip has licensed Arteris FlexNoC interconnect IP for use in image-based automotive ADAS systems.

We found that Arteris FlexNoC was by far the most complete interconnect IP offering available today. FlexNoC’s quality-of-service, simulation and integration features are eons ahead of all other commercial interconnect solutions.

Hweihn Chung, CTO and VP, Automotive BU, Nextchip

Semiconductor IP delivers best power consumption, unsurpassed ease-of-use, and shorter design schedules

CAMPBELL, Calif. — Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that SK Hynix, Inc., has licensed Arteris FlexNoC IP for use in its solid state memory storage products, including SSD controllers.

SUNNYVALE, California — November 6, 2013 — Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that Rich Yeon has been named Senior General Manager.

Rich Yeon has been an exceptional addition to the Arteris team since he joined in 2010. His attention to detail and unfailing customer support is reflected in his revenue generation. I am pleased to name him to this senior position and am confident he will meet the challenges of our growing Asian customers.

K. Charles Janac, President and CEO, Arteris

Network-on-Chip (NoC) interconnect technology leader enables higher performance and more cost effective designs for mobile phone systems-on-chip (SoCs)

SUNNYVALE, California — November 2, 2010 — Arteris, Inc., a leading supplier of on-chip interconnect IP solutions, today announced that Samsung Electronics Co., Ltd., has selected Arteris’ interconnect solutions for multiple chips within Samsung’s mobile SOC products. Samsung chose Arteris interconnect IP to support the high speed inter-chip communication requirements in next generation mobile SOC products.

The Arteris interconnect IP offers us a convenient solution to handle the high speed communication needed between our SoC and external modem IC. Our customers will benefit from the lower BOM cost and power consumption as a result of this IP. We look forward to Arteris’ interconnect IP helping us shorten development schedules and lower risks associated with compatibility.

Thomas Kim, Vice President, SoC Platform Development, System LSI, Samsung Electronics