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Non-Coherent Network-on-Chip IP Product Family

Build scalable SoCs faster with comprehensive non-coherent interconnect IP

Overview

Proven NoC IP for every SoC design point

The non-coherent network-on-chip IP product family brings together FlexGen®, FlexNoC®, and FlexWay® for modern SoC and chiplet development. From high-performance data center, AI, automotive, communications, consumer, enterprise, and industrial designs to cost-efficient MCUs and IoT edge devices, these solutions help teams select the right interconnect architecture for all performance, power, area, and schedule requirements.

  • FlexGen smart NoC IP
    AI-driven design automation for advanced SoCs and chiplets. FlexGen generates and refines optimized NoC topologies to minimize wirelength, latency, and design effort.
  • FlexNoC physically aware NoC IP
    Comprehensive interconnect IP for complex SoCs. FlexNoC helps teams optimize interconnect performance, power, and area, while accelerating timing closure.
  • FlexWay low-power entry NoC IP
    Entry-level NoC IP for cost-sensitive, low-power embedded SoCs, IoT edge devices, and MCUs.
SoC Developers
Advantages

Flexible interconnect IP for modern SoC requirements

The non-coherent network-on-chip IP product family provides SoC teams with a scalable path from demanding, high-performance AI-driven designs to compact embedded devices. It combines automation, physical awareness, power management, and performance optimization in a single product family.

Match each design to the correct NoC

Select FlexWay for smaller low-power designs; FlexNoC for broad complex SoC development; or FlexGen when smart automation and faster design exploration are critical.

Improve performance and latency

Optimized data transport, quality-of-service (QoS) support, performance exploration tools, and smart topology generation help ensure efficient data movement across the SoC.

Reduce power, area, and wirelength

NoC architectures reduce long global wiring, support advanced power management, and help minimize routing congestion, die area, and latency.

Scale with product needs

Safety, reliability, reorder-buffer, XL, and 2XL options extend IP solutions for larger systems, functional safety, resilience, and memory performance.

Accelerate development cycles with FlexGen

FlexGen automated configuration, topology generation, and verification support help reduce repetitive work and shorten iteration loops.

Support physical convergence earlier with FlexGen and FlexNoC

Physical awareness, floorplan visualization, and auto-timing closure assistance help teams address implementation issues before late-stage place-and-route.

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Features

Non-Coherent Network-on-Chip IP Product Family key features

Protocol, debug, verification, and integration

Scalability

Intuitive configuration UI

Design automation and exploration with FlexGen

Physical awareness and timing closure with FlexGen and FlexNoC

Performance, power, and area optimization

Feature Spotlight

NoC tiling for scalable AI and accelerator designs

NoC tiling - new feature with FlexNoC

FlexGen and FlexNoC support NoC tiling for highly scalable arrayed NPU, GPU, and TPU designs. Tiling helps teams create modular, repeatable architectures that can scale performance, speed testing, condense design time, and reduce design risk.

  • Create modular, scalable designs.
  • Use mesh topology for tiled accelerator architectures
  • Support up to 1024 tiles
  • Improve integration, verification, and optimization speed

Efficient data movement through the SoC

Integration with Arteris CodaCache® last-level cache raises the bar on innovation:

  • Ideal for NoC applications with data re-use
  • Improves overall SoC latency and power

Efficient data movement through the SoC​

Efficient Transport of Data Through the SoC

NoC integration automated flow

Automated flow to leverage SoC connectivity information using Arteris Magillem:

  • Improved productivity with reduced process
  • Better quality with early error detections thanks to checkers

NoC integration automated flow​

NoC Integration Automated Flow

Product comparison table

Category Features FlexWay FlexNoC FlexGen
Target Audience and Scale Smaller-scale MCU SoCs
Small-medium scale SoCs
Large scale SoCs
Instances Per Design Single NoC instance
Multiple NoC instances
Network Interface Units (NIUs) per die¹ Up to 50 NIUs
Up to 200 NIUs
Up to 1000 NIUs with XL option with XL option
Up to 2000 NIUs with 2XL option with 2XL option
Compatibility AXI, AHB, APB, OCP, PIF, AMBA5
ACE-Lite
Smart NoC Automation Topology generation with minimum wire length
Scripting-driven regular topology creation
Incremental design capability
Physical Awareness Automatic timing closure assistance
Floorplan visualization
Advanced Scalability
Spine Tiling2,3 with XL/2XL options with XL/2XL options
Mesh topology editor with XL/2XL options with XL/2XL options
Write broadcast stations with XL/2XL options with XL/2XL options
Virtual channel links with XL/2XL options with XL/2XL options
Source synchronous asynchronous bridges with XL/2XL options with XL/2XL options
Up to 1024 bits data bus with XL option with XL option
Up to 2048 bits data bus with 2XL option with 2XL option
512 pending transaction support with XL option with XL option
1024 pending transaction support with 2XL option with 2XL option
Optimizations Optimization for performance, area and wire length
Advanced Quality of Service (QoS)
Power management and security
Address and data protection schemes
Advanced in-circuit debug features
Multi-cycle SRAM support
Floorplan visualization
Add-on Options Memory Re-order Buffer option
Reliability option
Safety (up to ISO 26262 ASIL D) option
Advanced Scalability (XL/2XL) options
Markets Automotive, Aerospace & Defence, Communications, Consumer Electronics, Enterprise Computing and Industrial Markets

¹ NIU limits apply per individual monolithic die or chiplet design.

² FlexGen is advised for customers seeking to create a mesh topology using tiling.

³ Customers seeking to license multiple optional features should disclose its requirements to Arteris support engineers. Given the increasing complexity of designs, customers are advised to communicate their specific design needs to Arteris support engineers.

Fully integrated product options

Large Systems: XL Option
Option
Large Systems: XL and 2XL
  • NIU tiling
  • Mesh topology editor
  • Up to 2048 bits data bus
  • Virtual channel links
  • Write broadcast stations
  • Up to 1024 pending transactions
* Available for FlexGen and FlexNoC
learn more about option
Resilience Safety Option
Option
Resilience: Safety
  • ISO 26262 Functional Safety (FuSa)
  • Multi-ASIL support
  • Interconnect-wide ECC support
learn more about option
Reorder Buffer (1)
Option
Performance: Reorder Buffer

Single and multichannel reorder buffers (ROB):

  • Avoid ordering rule blocks
  • Avoid response serialization bottlenecks
  • Allow concurrent memory channel reads
learn more about option
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Featured Solution

Multi-die solution accelerates AI-driven silicon innovation

Foundational technology for rapid chiplet-based design.
  • Flexible design scalability
  • Differentiated AI performance
  • Aligned with evolving industry standards
Built on silicon-proven NoC IP and Magillem® automation to scale modular architectures, the Arteris multi-die solution helps simplify multi-die projects, and compress development schedules.
Customer Testimonials

Trusted by innovative
companies everywhere

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Support and Training

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Support and services

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