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AMS System-Level Verification and Validation using UVM in SystemC and SystemC-AMS: Automotive Use Cases

This 12-page paper published in the peer-reviewed IEEE Design & Test journal explains how Universal Verification Methodology (UVM), initially developed for digital systems, can be extended to analog and mixed signal systems with the help if IP-XACT-based IP packaging and design flow automation.

White Paper

Fundamentals of Semiconductor ISO 26262 Certification: People, Process and Product

Written by an ISO 26262 working group member who contributed to the new ISO 26262:2018 Part 11, this paper dispels myths about ISO 26262 certification and seeks to enhance the reader’s knowledge regarding all aspects of the ISO 26262 standard. This paper also discusses the standard’s applicability not only to electronic products, but also to the people and processes employed to create them.

White Paper

Mobileye Case Study: Using Arteris for ADAS

In this 4-page paper, created with the participation of Mobileye, you will learn how the world’s #1 vision-based automotive ADAS company uses Arteris FlexNoC interconnect IP to address demanding high bandwidth and low-latency requirements.

White Paper

Scalability – A Looming Problem in Safety Analysis

Misbehavior in the electronics can lead to accidents, even fatalities. This paper describes how ISO 26262 standard and in particular the Failure Modes, Effects and Diagnostic Analysis (FMEDA) can be leveraged to address this real concern.

White Paper

Using Machine Learning for Characterizations of NoC Components

This Award Winning Paper was presented at Synopsys SNUG Silicon Valley 2019. You will learn about modern NoC (Network-on-Chip) is built of complex functional blocks, such as packet switches and protocol converters. PPA (performance/power/area) estimates for these components are highly desirable during early design phases – long before NoC gate level netlist is synthesized.

Network-on-Chip (NoC)

Presentation

Automating the Generation of Scalable and Reusable FMEDA in Complex Systems-on-Chip (SoCs)

Presented at IQPC Application of ISO 26262 2022 Conference, describes an approach that uses a hierarchal and modular library of safety components to describe failure modes, safety mechanism diagnostic coverage, and other functional safety metrics at a level that scales with the size and complexity of an SoC and enables reuse for the creation of SoC platform derivative chips, which is common in our industry.

Presentation

Building Better IP with RTL Architect NoC IP Physical Exploration

Voted one of the “Top Ten Best Presentations” at SNUG Silicon Valley 2023, this presentation discusses the importance of NoCs and their impact on timing analysis and power consumption. It introduces a flow and methodology that utilizes RTL-based estimation of timing and power consumption using RTL Architect in conjunction with Arteris’ FlexNoC 5 and Ncore NoC development frameworks. FlexNoC 5 facilitates up to 5X faster physical convergence of the back-end physical design time and effort.

Presentation

FMEDA Automation for Scalability and Reuse in Complex Systems on Chips (SoCs)

Failure modes, effects, and diagnostic analysis (FMEDA) for sophisticated chips with hundreds of IP blocks are fraught with complexity and opportunities for systematic errors. This presentation will describe an approach that uses a hierarchal and modular library of safety components to describe failure modes, safety mechanism diagnostic coverage, and other functional safety metrics.

Presentation

Is the Missing Safety Ingredient in Automotive AI Traceability?

Presented at The Linley Spring Processor Conference 2022, describes the importance of traceability as it applies to managing SoC requirements and customer deliverables whilst also shortening the path to functional safety certification including ISO 26262.

Presentation

Lessons Learned Integrating AI/ML Accelerators into Complex ISO 26262 Compliant Systems-on-Chip

Presented at the ISO 26262 for Semiconductors (Munich) Conference, this presentation describes the differences between “regular” and AI-enabled automotive chips in the following dimensions: PPA, Safety and Schedule.

ISO 26262

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