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Tags: Magillem Packaging

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Electronic Design: Speeding the Process of Building IPs, Chiplets, and SoCs
Designing modern SoCs and multi-die systems requires faster integration of thousands of IP blocks and chiplets while minimizing errors. Structured metadata standards like IP-XACT, combined with automation, are transforming this process by ensuring consistency, tool interoperability, and accurate hardware/software alignment
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Design & Reuse: Efficient IP Packaging for Today’s SoC Integration
As SoC architectures scale in complexity, managing hundreds of IP blocks consistently from concept through production is critical to avoid costly errors and rework. Standardizing IP descriptions with IEEE 1685 (IP-XACT) and automating packaging ensures interoperability, accelerates design, and promotes
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Semiconductor Engineering: System Integration With Standards-Based Automation
As SoCs evolve into complex multi-die systems, standards-based automation is key. Learn how IP-XACT and Arteris’ Magillem tools enable consistent metadata, scalable IP reuse, and faster, error-free integration across teams and tools.
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