Ncore Archives - Arteris

Design & Reuse: Topology and Data Movement in Multi-Die Design

This article explores how multi-die design shifts the primary challenge from scaling silicon to managing data movement and system integration across chiplets. It highlights the critical role of NoC topology in controlling traffic, latency, and coherency between dies, as well

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Arteris × XuanTie: The “Data Highway” for High-Performance RISC-V SoCs

Arteris and XuanTie have formed a deep partnership, leveraging the Ncore cache-coherent NoC IP as the core to build a "data highway" for high-performance RISC-V SoCs. Ncore paired with the XuanTie C930 delivers 30 GB/s/GHz bandwidth and 110-cycle latency, supporting

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Semiconductor Engineering: Importance Of Hardware Security Verification In Pre-Silicon Design

Security in modern semiconductor design must be built in from the start, not validated after the fact. This article explains how pre-silicon hardware security verification relies on two key pillars — functional verification to ensure security features behave correctly, and

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Semiconductor Engineering: The Future Of SoC Design Is Data Movement

The semiconductor industry is shifting from focusing on raw compute to tackling the growing challenge of data movement in complex SoCs. With advances in chiplets, high-bandwidth memory, CXL fabrics, and automotive zonal architectures, predictable performance now depends on layered, automated,

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Critical Safety Overview and Definitions

Overview of critical safety systems and functional safety standards in automotive, focusing on ISO 26262 compliance and its impact on SoC design and performance.

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Semiconductor Engineering: A Smarter Path To Chiplets Through An Enhanced Multi-Die Solution

With monolithic SoCs reaching their limits, chiplet-based architectures are key to building flexible, high-performance systems. Arteris’ multi-die solution combines silicon-proven NoC IP, cache coherency, and automation tools to streamline chiplet integration and accelerate time-to-market. Learn more in the article.

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RISC-V: Arteris’ Multi-Die Solution for the RISC-V Ecosystem

As AI, HPC, and automotive workloads push past the limits of monolithic SoCs, chiplet-based design offers a scalable and cost-efficient path forward. Arteris enables this shift with advanced NoC IP for coherent and non-coherent multi-die interconnects, UCIe-based die-to-die links, and

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EDN: Chiplet design basics for engineers

As AI and HPC workloads intensify, engineers are turning to chiplet-based architectures to overcome the limitations of traditional SoCs. This article explains the fundamentals of chiplet design, its advantages, and the tools enabling scalable, high-performance multi-die systems.

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Semiconductor Engineering: Reducing SoC Power With NoCs And Caches

The growing complexity of integrating multiple processing elements, memory systems and communication interfaces into a single SoC demands innovative solutions to optimize power efficiency. Arteris offers a comprehensive suite of IP products, including FlexNoC, Ncore and CodaCache that address these

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Design & Reuse: Accelerating SoC Evolution With NoC Innovations Using NoC Tiling for AI and Machine Learning

A new trend is emerging in the design of high-end, multi-billion-transistor system-on-chip (SoC) devices and it is called “NoC tiling”. It’s an innovative approach that facilitates scaling, condenses design time, speeds testing, and reduces risk.

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