Arteris Press Releases

Arteris FlexNoC Resilience Package IP Licensed by STMicroelectronics

Functional safety and data protection features enable more complex SoCs that can meet stringent ISO 26262 standards

CAMPBELL, Calif. — Oct. 4, 2016 — Arteris Inc., the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that STMicroelectronics has licensed Arteris FlexNoC interconnect IP along with the FlexNoC Resilience Package.

...we are finding that hardware data protection within the interconnect is increasingly required to meet our desired ISO 26262 ASIL levels. In our never-ending efforts to improve efficiency, we’ve found Arteris technology is helping us meet our safety and time-to-market goals.

Fabio Marchio, Vice President, Automotive and Discrete Group, STMicroelectronics

Topics: ISO 26262 automotive semiconductors Arteris FlexNoC new customer flexnoc resilience package ADAS iso 26262 ASIL advanced driver assistance systems adas STMicroelectronics automotive functional safety

Arteris and YOGITECH Announce Strategic Partnership Enabling ISO 26262 Compliant Advanced Automotive Systems-on-Chip

Integration of Arteris FlexNoC Resilience Package and YOGITECH faultRobust technology enables more efficient ISO 26262 and ASIL compliance

CAMPBELL, California and PISA, Italy — February 17, 2015 — Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, and YOGITECH S.p.A., the leader in functional safety verification tooling and solutions, today announced a strategic partnership to help semiconductor design teams develop automotive and industrial systems-on-chip (SoCs) more effectively. The two industry-leading companies are teaming up to integrate their products to enable SoC vendors to more easily implement and assess functional safety requirements in complex chips.

The fruits of this YOGITECH and Arteris partnership will help the automotive and semiconductor industries to more quickly implement in silicon the complex features required for autonomous driving systems.

Implementing functional safety features in silicon offers many advantages over software-only approaches by enabling less complexity, pre-characterized quality and more semiconductor vendor control over the system-wide functional safety feature implementations.

Silvano Motto, President and CEO, Arteris

Topics: ISO 26262 automotive semiconductors flexnoc resilience package ECC yogitech

Arteris FlexNoC Resilience Package Enhances Redundancy, Fault Tolerance for Mission Critical Systems-on-Chip

New technology augments network-on-chip interconnect IP, boosting reliability while improving design flexibility for automotive, aerospace and industrial electronics

CAMPBELL, California — September 30, 2014 — Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced the new FlexNoC Resilience Package designed to increase reliability and lower the cost of developing resilient and fault tolerant systems-on-chip (SoCs). The FlexNoC Resilience Package enhances the benefits of Arteris FlexNoC network-on-chip fabric IP to automotive, aerospace defense, industrial equipment and other electronics markets requiring fault tolerance.

A growing number (of OEMs and system suppliers) are turning to safety- and security-optimized network-on-chip subsystems for SoCs, such as the FlexNoC Resilience Package, to lower the development costs and the time it takes to achieve the ISO 26262 certification, enabling both media-intense processing and certifiable mission critical solutions in an integrated SoC.

Tom Hackenberg, Automotive Embedded Processors Principal Analyst, IHS Technology

Topics: functional safety ISO 26262 new product automotive