Overview
Unforgiving schedule challenges drive Consumer markets – missing specific seasons like Christmas can decide company destinies – and developing semiconductor components for consumer applications is an intricate task riddled with numerous challenges, including cost pressures due to the extreme price sensitivity of end applications. In addition, consumer electronics are trending towards being smaller, lighter, and more portable, while consumers expect simultaneous increased functionality and performance. Power consumption and heat management are paramount as devices become smaller and more powerful, and consumers demand devices with longer battery life that do not overheat.
With Arteris’ NoC and SoC Integration technologies, developers de-risk their projects to meet the aggressive schedule demands of consumer markets while optimizing area usage with physically aware optimization, leading to the lowest power implementation to meet end-user cost and battery life expectations.
Key Benefits
Time to Market
Arteris technology helps speed up the design process. Rapid design and development cycles give companies a significant competitive advantage in the fast-paced consumer technology sector.
Optimized PPA
Arteris' interconnect IP solutions optimize consumer systems' performance, power consumption, and cost, allowing semiconductor vendors to meet the expectations of end users of consumer applications.
Advanced SoC Integration
Arteris' solutions aid developers in addressing the challenges of integrating multiple heterogeneous processing elements, memory systems, and communication interfaces into a single SoC.
Latest Innovation
FlexGen’s built-in AI/ML-driven automation enables the generation of optimized NoC designs for complex SoCs, delivering expert-level results.
- 10x Productivity Boost
- Expert-Level Results
- Up to 30% Wire Length Reduction
Realize faster time-to-market, optimized power plus performance, and improved overall design economics with FlexGen.