Semiconductor Engineering: Edge Complexity To Grow For 5G

Kevin Fogarty and Ed Sperling, Jul 02, 2019

Arteris IP’s Kurt Shuler, Vice President of Marketing, quoted in the latest Semiconductor Engineering article:

Increased interdependence of technologies will drive different architectures and applications. 

It gets even more complicated in the automotive world than other any other markets because of safety-critical circuitry.

“You may have to reboot part of the chip for a failed operation, while keeping the rest of it operating in a safe state,” said Kurt Shuler, vice president of marketing at Arteris IP. “If you think about the space shuttle or a Boeing 777, the black boxes are 20 pounds. You can’t have that in a car. There is a lot of functional safety being done at the microprocessor level to save cost. That can be used to spy on what’s happening at the system level, so if there are problems you can isolate them and in a safe state and fail gracefully. If there is a transient error, you reboot.”

For more information, please download the Arteris FlexNoC AI Package Datasheet.

To read the entire article on the SemiEngineering page, please click here.

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