Arteris Joins TSMC Soft IP Alliance

by Arteris, On Oct 12, 2010

Network-on-Chip (NoC) interconnect technology leader optimizes product portfolio for TSMC Open Innovation Platform™ design methodology to accelerate SoC innovation

SUNNYVALE, California – October 12, 2010 – Arteris, Inc., a leading supplier of on-chip interconnect IP solutions, today announced that it has joined the TSMC Soft IP Alliance Program included in TSMC’s Open Innovation Platform™. Arteris has worked with TSMC over the past year to provide documentation, design methodology development, engineering process validation, and technology information that makes Arteris NoC IP solutions more accessible to SoC makers using advanced TSMC manufacturing processes.

We have been working with Arteris to assure an optimized path from architecture to silicon for customers using the Arteris NoC technology.

Dan Kochpatcharin, Deputy Director of IP Portfolio Marketing, TSMC

Arteris FlexNoC™ product line enables SoC designers to achieve lower power, higher memory bandwidth and optimized latencies by individual connections, to improve SoC performance, lower SoC design cost, and enable rapid adoption of IPs communicating in variety of protocols. Arteris’ goal in participating in the TSMC Soft IP Alliance Program is to provide a smooth path from NoC interconnect architectural decisions all the way to silicon on variety of TSMC manufacturing processes. Arteris worked with TSMC during the development of TSMC’s Reference Flow 11 to validate quality procedures, documentation and methodology synchronization.

“Issues such as power consumption, memory bandwidth, and timing closure are easier to address at the architectural level. By utilizing our silicon proven NoC IP technology, designers can analyze a variety of implementation alternatives in the context of what their impact on manufacturing will be,” said Charlie Janac, President and CEO of Arteris, Inc. “By working with TSMC, our aim is to provide designers with access to physical implementation information earlier in the design process to reduce risk and accelerate time to market of our mutual customers.”

“TSMC welcomes Arteris to our Soft IP Alliance Program,” said Dan Kochpatcharin, deputy director, IP Portfolio Marketing at TSMC. “We have been working with Arteris to assure an optimized path from architecture to silicon for customers using the Arteris NoC technology.”

About Arteris

Arteris, Inc. provides semiconductor interconnect IP and tools to improve the performance and lower costs of highly-integrated ICs for wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs.

Founded by networking experts, Arteris operates globally with headquarters in Sunnyvale, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech. More information can be found at

Arteris and the Arteris logo are trademarks of Arteris, Inc.