Arteris Articles

SemiWiki: AI, Safety and the Network

Kurt Shuler, VP Marketing at Arteris IP, and Bernard Murphy (SemiWiki) discuss, 'What is driving the boom in AI-centric design', in this new SemiWiki blog:

AI, Safety and the Network

September 4th, 2019 - By Bernard Murphy

You probably know that Arteris IP is very active in AI and safety, leveraging their central value in network-on-chip (NoC) architectures. Bernard Murphy of SemiWiki blogged on Kurt Shuler's front-to-back white-paper to walking us through the essentials of AI, particularly machine learning (ML) and its application for example in cars.

Kurt also highlights an interesting point about this rapidly evolving technology. As we build automation from the edge to the fog to the cloud, functionality, including AI, remains quite fluid between levels. Kurt points out that this is somewhat mirrored in SoC design. In both cases architecture is constrained by need to optimize performance and minimize power across the system through intelligent bandwidth allocation and data locality. And for safety-critical applications, design and verification for safety around intelligent features must be checked not only within and between SoCs in the car but also beyond, for example in V2x communication between cars and other traffic infrastructure.

You can learn more by downloading this Arteris IP white paper titled, Re-Architecting SoCs for the AI Era: https://semiwiki.com/automotive/274598-ai-safety-and-the-network/

Topics: SoC functional safety ISO 26262 semiconductor automotive ADAS machine learning artificial intelligence semiwiki kurt shuler flexnoc ai package noc interconnect

New! Arteris IP Technical Paper, Re-Architecting SoCs for the AI Era

Kurt Shuler, VP of Marketing at Arteris IP has written this 10-page technical paper titled, "Re-Architecting SoCs for the AI Era".

August 29, 2019 - by Kurt Shuler

Abstract:
The growth of artificial intelligence (AI) demands that semiconductor companies re-architect their system on chip (SoC) designs to provide more scalable levels of performance, flexibility, efficiency, and integration. From the edge to data centers, AI applications require a rethink of memory structures, the numbers and types of heterogeneous processors and hardware accelerators, and careful consideration of how the dataflow is enabled and managed between the various high-performance IP blocks.

Topics: functional safety ISO 26262 semiconductor machine learning autonomous driving artificial intelligence AI SoCs kurt shuler noc interconnect ML dataflow

EE Times article, The Gatekeeper of a Successful Design is the Interconnect

K. Charles Janac, President and CEO, at Arteris IP, authored this article on how an effective interconnect makes delivering a complex SoC easier, more predictable, and less costly.

August 25, 2019 - by K. Charles Janac

An interconnect handles various types of traffic inside an SoC and is a mechanism for effective IP block integration. The interconnect is the most configurable IP in the SoC — typically changing many times during a project and nearly always changing between projects. It also plays a vital role in security and functional safety because it carries most of the SoC data and contains nearly all the SoC’s long wires and system-level services, including quality of service (QoS), visibility, physical awareness, and power management. The interconnect enables cache coherency in multiprocessor SoCs, high-performance and bandwidth levels in advanced driver assistance systems (ADAS) automotive chips and networking SoCs, and ultra-low power in long-running consumer devices.

Topics: semiconductor eetimes advanced driver assistance systems adas autonomous driving AI K. Charles Janac SoCs noc interconnect ML data center automation

Semiconductor Engineering: Chiplets, Faster Interconnects, More Efficiency

 Arteris IP's K. Charles Janac, president and CEO, chats with Ed Sperling at Hot Chips in this latest Semiconductor Engineering article:

Chiplets, Faster Interconnects, More Efficiency

August 22nd, 2019 - By Ed Sperling

Big chipmakers are turning to architectural improvements such as chipsets, faster throughput both on-chip and off-chip, and concentrating more work per operation or cycle, in order to ramp up processing speeds and efficiency.

 

“Everyone is struggling with CCIX,” said K. Charles Janac, president and CEO of Arteris IP. “If you have an accelerator and two coherent dies, there are too many corner cases to get it to work easily. But now you can use 3D interconnects to hook together a planar CPU and a planar I/O. So this looks like one system to the software, and you have inter-chip links between the network on chip and different die. That way you can support non-coherent and coherent read/write across two die. It makes the interconnect more valuable, but it also makes it more complicated.”

“The memory controller and the NoC will have to be much more tightly integrated,” said Janac. “The problem is that neither one understands the QoS of the entire chip, and there aren’t any independent memory controller companies left. But memory traffic has to be better integrated to make this work.”

For more information, please visit our Resources page for free downloads of our technical papers; http://www.arteris.com/resources

Topics: SoC ArterisIP FlexNoC ncore cache coherent interconnect semiconductor engineering K. Charles Janac noc interconnect Hot Chips