Arteris Articles

Arteris IP Awarded 1st Place for Technical Paper at Synopsys Users Group (SNUG) Silicon Valley 2019

Benny Winefeld, Solutions Architect at Arteris IP, Awarded 1st Place Best Paper Award at SNUG Silicon Valley 2019 

Arteris IP presented this technical paper, "Using Machine Learning for Characterization of NoC Components", on March 20, 2019.

Benny Winefeld, Solutions Architect at Arteris IP, accepted the 1st Place Best Paper Award from the SNUG Technical Committee during SNUG Silicon Valley. There were 29 papers that competed for the best paper award.

In the photo above, Benny receives the award from the SNUG committee, from left to right: Ken Nelson, VP Field Support Operations; Benny Winefeld, Solutions Architect, Arteris IP; Tony Todesco, SNUG SV Technical Chair, AMD; and Deirdre Hanford, Co-GM, Synopsys.

Topics: Synopsys NoC machine learning artificial intelligence Soft IP noc interconnect SNUG

Semiconductor Engineering: Big Shift In Multi-Core Design

 Arteris IP's Kurt Shuler, Vice President of Marketing, adds commentary in this article in Semiconductor Engineering.

Big Shift In Multi-Core Design

April 3rd, 2019 - By Ann Steffora Mutschler

System-wide concerns in AI and automotive are forcing hardware and software teams to work together, but gaps still remain.

Minding the gap
There are indications that mindset is beginning to change, particularly in markets such as automotive where systemic complexity extends well beyond a single chip or even a single vehicle.

“In the past, if you were a software engineer, the thinking was, ‘I have this chip available. Here’s what I can produce with my software,'” said Kurt Shuler, vice president of marketing at Arteris IP. “Nowadays, especially in the ADAS side of things that have an AI component or some kind of programmable object detection for the ADAS functionality, or an AI chip—whether it’s for the data center, edge, inference or training—the thinking has shifted more to system-design decisions. If this is designed with this given set of software algorithms, it is clear what needs to happen at a system level from the hardware and software point of view. At what level of detail should I optimize this hardware for the particular software I expect to run? This means the hardware and the software are now much more tightly integrated in those use cases than they probably have ever been unless it’s a very detailed embedded application. So now, in the early stages of design for these types of chips, whether it’s the autonomous driving chips or the AI chips, the software architect is in there, too.”

This is a definite sign of progress. “Before, they didn’t care,” Shuler said. “The layer/API between hardware and software is becoming less generic and more specific for those kinds of use cases, solving those kinds of problems. What that means, though, is there are software guys who went to Stanford and trained on Java script and have no idea what a register is. Then there are hardware guys who have no idea what a hypervisor or object-oriented programming is.”

For more information on AI, please click on the Arteris FlexNoC AI Package webpage: http://www.arteris.com/flexnoc-ai-package.

Topics: SoC software automotive ADAS autonomous driving semiconductor engineering AI hardware noc interconnect

Arteris IP is Presenting at The Linley Spring Processor Conference April 10 - 11, 2019!


Don't Miss the Arteris IP Presentation on AI SoC Architectures, Thursday, April 11, 2019 

Location: Hyatt Regency, Santa Clara, CA
Session 5: SoC Design: Thursday, April 11
1:15 pm - 2:45 pm

Arteris IP presenting: "Adapting SoC Architectures for Types of Artificial-Intelligence Processing"

Come to the Linley Spring Processor Conference on April 10 - 11, 2019  - and attend the Arteris IP presentation on Thursday, April 11 during Session 5: SoC Design, were we will describe lessons learned on how to use network-on-chip (NoC) technology to efficiently implement SoC architectures targeted for different types of AI processing, including advanced techniques like when to use tiling or cache coherence, whether for edge/battery-operated or datacenter chips. 

April 11 Agenda: https://www.linleygroup.com/events/agenda.php?num=46&day=2

Topics: NoC semiconductor ArterisIP artificial intelligence SoCs edge/battery-operated cache coherence datacenter chips

Semiconductor Engineering: AI: Where's The Money?

 Arteris IP's Kurt Shuler, Vice President of Marketing, authored this article in Semiconductor Engineering about Artificial Intelligence (AI), and asks what is hype and what is reality?

AI: Where's The Money?

March 7th, 2019 - By Kurt Shuler

What the market for AI hardware might look like in 2025.

A one-time technology outcast, Artificial Intelligence (AI) has come a long way. Now there's groundswell of interest and investment in products and technologies to deliver his performance visual recognition, matching or besting human skills. We're overwhelmed by possibilities, but what is often less clear is where the money is really going. What is aspiration, what is hype and what is reality?

There are multiple ways to slice this question, such as dividing by applications or implementation choices. At Arteris IP, we have a unique view because our interconnect technology is used in many custom AI designs which, as we’ll see, are likely to dominate the space. Combining this view with recent McKinsey analyses provides some interesting and, in some cases, surprising insights.

Bottom line: AI is big, but there is no such thing as a “standard AI chip.” Optimal chip architectures differ according to the types of functions that must be executed, where they must be performed, and within what amount of time and power budget.

For more information on AI, please click on the Arteris FlexNoC AI Package webpage: http://www.arteris.com/flexnoc-ai-package.

Topics: SoC functional safety automotive semiconductor engineering AI noc interconnect chip architectures datacenters